Inventor · disambiguated record
John M. Boyd
Also filed as: BOYD JOHN · BOYD JOHN M
135 granted patents·21 pending applications·2,213 citations·filing 1988–2015
99Inventor score
Top patents by PatentIndex Score
156 records- 0198US6599765B1Apparatus and method for providing a signal port in a polishing pad for optical endpoint detectionLAM RES CORP·Filed 2001·Granted Jul 29, 2003·104 cites·11 claims
- 0297US6358118B1Field controlled polishing apparatus and methodLAM RES CORP·Filed 2000·Granted Mar 19, 2002·79 cites·36 claims
- 0395US7367345B1Apparatus and method for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2004·Granted May 6, 2008·62 cites·22 claims
- 0494US7615480B2Methods of post-contact back end of the line through-hole via integrationLAM RES CORP·Filed 2007·Granted Nov 10, 2009·22 cites·17 claims
- 0594US7191787B1Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluidLAM RES CORP·Filed 2003·Granted Mar 20, 2007·81 cites·17 claims
- 0694US6146242AOptical view port for chemical mechanical planarization endpoint detectionSTRASBAUGH INC·Filed 1999·Granted Nov 14, 2000·118 cites·2 claims
- 0793US6626743B1Method and apparatus for conditioning a polishing padLAM RES CORP·Filed 2000·Granted Sep 30, 2003·40 cites·10 claims
- 0893US6612904B1Field controlled polishing apparatusLAM RES CORP·Filed 2001·Granted Sep 2, 2003·42 cites·20 claims
- 0992US7829152B2Electroless plating method and apparatusLAM RES CORP·Filed 2006·Granted Nov 9, 2010·18 cites·8 claims
- 1092US7749689B2Methods for providing a confined liquid for immersion lithographyLAM RES CORP·Filed 2008·Granted Jul 6, 2010·13 cites·14 claims
- 1192US6953515B2Apparatus and method for providing a signal port in a polishing pad for optical endpoint detectionLAM RES CORP·Filed 2003·Granted Oct 11, 2005·35 cites·11 claims
- 1291US8241701B2Processes and systems for engineering a barrier surface for copper depositionDORDI YEZDI·Filed 2006·Granted Aug 14, 2012·16 cites·28 claims
- 1391US6475332B1Interlocking chemical mechanical polishing systemLAM RES CORP·Filed 2000·Granted Nov 5, 2002·44 cites·13 claims
- 1491US6435952B1Apparatus and method for qualifying a chemical mechanical planarization processLAM RES CORP·Filed 2000·Granted Aug 20, 2002·36 cites·13 claims
- 1591US5362669AMethod of making integrated circuitsNORTHERN TELECOM LTD·Filed 1993·Granted Nov 8, 1994·136 cites·5 claims
- 1690US8771804B2Processes and systems for engineering a copper surface for selective metal depositionDORDI YEZDI·Filed 2006·Granted Jul 8, 2014·16 cites·27 claims
- 1790US8622020B2Simultaneous electroless plating of two substratesTHIE WILLIAM·Filed 2010·Granted Jan 7, 2014·10 cites·17 claims
- 1890US8287647B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Oct 16, 2012·12 cites·7 claims
- 1990US5352923ATrench resistors for integrated circuitsNORTHERN TELECOM LTD·Filed 1993·Granted Oct 4, 1994·75 cites·13 claims
- 2090US4922155AProtective circuit for reduced voltage lampsGTE PROD CORP·Filed 1988·Granted May 1, 1990·65 cites·13 claims
- 2189US7329321B2Enhanced wafer cleaning methodLAM RES CORP·Filed 2005·Granted Feb 12, 2008·13 cites·13 claims
- 2289US7153400B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2003·Granted Dec 26, 2006·33 cites·12 claims
- 2389US6910240B1Wafer bevel edge cleaning system and apparatusLAM RES CORP·Filed 2002·Granted Jun 28, 2005·44 cites·9 claims
- 2488US7179154B1Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassetteLAM RES CORP·Filed 2005·Granted Feb 20, 2007·12 cites·19 claims
- 2588US6488568B1Optical view port for chemical mechanical planarization endpoint detectionLAM RES CORP·Filed 2000·Granted Dec 3, 2002·34 cites·12 claims
- 2687US5614750ABuried layer contact for an integrated circuit structureNORTHERN TELECOM LTD·Filed 1995·Granted Mar 25, 1997·71 cites·15 claims
- 2786US8916232B2Method for barrier interface preparation of copper interconnectYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Dec 23, 2014·9 cites·30 claims
- 2886US7810513B1Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the sameLAM RES CORP·Filed 2005·Granted Oct 12, 2010·10 cites·16 claims
- 2986US6607425B1Pressurized membrane platen design for improving performance in CMP applicationsLAM RES CORP·Filed 2000·Granted Aug 19, 2003·31 cites·29 claims
- 3086US5394000ATrench capacitor structureNORTHERN TELECOM LTD·Filed 1993·Granted Feb 28, 1995·59 cites·9 claims
- 3186US5316978AForming resistors for intergrated circuitsNORTHERN TELECOM LTD·Filed 1993·Granted May 31, 1994·56 cites·10 claims
- 3286US5275974AMethod of forming electrodes for trench capacitorsNORTHERN TELECOM LTD·Filed 1992·Granted Jan 4, 1994·60 cites·20 claims
- 3385US8026605B2Interconnect structure and method of manufacturing a damascene structureLAM RES CORP·Filed 2006·Granted Sep 27, 2011·8 cites·18 claims
- 3485US7584761B1Wafer edge surface treatment with liquid meniscusLAM RES CORP·Filed 2005·Granted Sep 8, 2009·10 cites·8 claims
- 3584US6547651B1Subaperture chemical mechanical planarization with polishing pad conditioningSTRASBAUGH·Filed 2000·Granted Apr 15, 2003·26 cites·23 claims
- 3683US8747960B2Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicideDORDI YEZDI·Filed 2006·Granted Jun 10, 2014·11 cites·20 claims
- 3783US8519461B2Device with post-contact back end of line through-hole via integrationBOYD JOHN·Filed 2012·Granted Aug 27, 2013·4 cites·5 claims
- 3883US7615486B2Apparatus and method for integrated surface treatment and deposition for copper interconnectLAM RES CORP·Filed 2007·Granted Nov 10, 2009·7 cites·22 claims
- 3982US6471566B1Sacrificial retaining ring CMP system and methods for implementing the sameLAM RES CORP·Filed 2000·Granted Oct 29, 2002·23 cites·28 claims
- 4081US7691278B2Apparatus for the removal of a fluorinated polymer from a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Apr 6, 2010·6 cites·20 claims
- 4181US6705930B2System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniquesLAM RES CORP·Filed 2001·Granted Mar 16, 2004·23 cites·14 claims
- 4280US7947157B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2006·Granted May 24, 2011·5 cites·15 claims
- 4380US5516710AMethod of forming a transistorNORTHERN TELECOM LTD·Filed 1994·Granted May 14, 1996·65 cites·17 claims
- 4479US8926789B2Apparatus for the removal of a fluorinated polymer from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Jan 6, 2015·4 cites·19 claims
- 4579US7170190B1Apparatus for oscillating a head and methods for implementing the sameLAM RES CORP·Filed 2003·Granted Jan 30, 2007·21 cites·17 claims
- 4679US6858091B2Method for controlling galvanic corrosion effects on a single-wafer cleaning systemLAM RES CORP·Filed 2001·Granted Feb 22, 2005·19 cites·20 claims
- 4778US7090562B1Methods of and apparatus for pre-planarizing a substrateLAM RES CORP·Filed 2005·Granted Aug 15, 2006·7 cites·11 claims
- 4877US7862693B2Apparatus for plating semiconductor wafersLAM RES CORP·Filed 2009·Granted Jan 4, 2011·4 cites·14 claims
- 4977US7752996B2Apparatus for applying a plating solution for electroless depositionLAM RES CORP·Filed 2006·Granted Jul 13, 2010·4 cites·9 claims
- 5077US7231682B1Method and apparatus for simultaneously cleaning the front side and back side of a waferLAM RES CORP·Filed 2003·Granted Jun 19, 2007·19 cites·14 claims
Showing the top 50 of 156 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →