Inventor · disambiguated record
Joerg Busch
Also filed as: BUSCH JOERG
5 granted patents·21 citations·filing 2004–2019
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0185US8765531B2Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangementGATTERBAUER JOHANN·Filed 2012·Granted Jul 1, 2014·11 cites·23 claims
- 0271US7737560B2Metallization layer for a power semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2006·Granted Jun 15, 2010·6 cites·7 claims
- 0349US7276803B2Semiconductor component and method for fabricatingINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 2, 2007·4 cites·15 claims
- 0446US11081384B2Method for stabilizing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 0543US11127693B2Barrier for power metallization in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →