Inventor · disambiguated record
Jon Dcamp
Also filed as: DCAMP JON · DCAMP JON B
13 granted patents·7 pending applications·194 citations·filing 2003–2010
92Inventor score
Top patents by PatentIndex Score
20 records- 0194US7491567B2MEMS device packaging methodsHONEYWELL INT INC·Filed 2005·Granted Feb 17, 2009·37 cites·28 claims
- 0288US7074636B2Methods and apparatus for attaching getters to MEMS device housingsHONEYWELL INT INC·Filed 2005·Granted Jul 11, 2006·17 cites·24 claims
- 0386US7736946B2System and method for sealing a MEMS deviceHONEYWELL INT INC·Filed 2007·Granted Jun 15, 2010·16 cites·20 claims
- 0485US7370530B2Package for MEMS devicesHONEYWELL INT INC·Filed 2004·Granted May 13, 2008·42 cites·37 claims
- 0583US7482193B2Injection-molded package for MEMS inertial sensorHONEYWELL INT INC·Filed 2004·Granted Jan 27, 2009·36 cites·25 claims
- 0669US6914323B2Methods and apparatus for attaching getters to MEMS device housingsHONEYWELL INT INC·Filed 2003·Granted Jul 5, 2005·14 cites·17 claims
- 0761US6927098B2Methods and apparatus for attaching MEMS devices to housingHONEYWELL INT INC·Filed 2003·Granted Aug 9, 2005·10 cites·20 claims
- 0860US7491581B2Dicing technique for flip-chip USP wafersHONEYWELL INT INC·Filed 2006·Granted Feb 17, 2009·1 cites·6 claims
- 0960US6987304B2Methods and apparatus for particle reduction in MEMS devicesHONEYWELL INT INC·Filed 2003·Granted Jan 17, 2006·10 cites·16 claims
- 1057US7297573B2Methods and apparatus for particle reduction in MEMS devicesHONEYWELL INT INC·Filed 2005·Granted Nov 20, 2007·2 cites·9 claims
- 1153US7314777B2Chip packaging systems and methodsHONEYWELL INT INC·Filed 2004·Granted Jan 1, 2008·3 cites·22 claims
- 1253US7037805B2Methods and apparatus for attaching a die to a substrateHONEYWELL INT INC·Filed 2004·Granted May 2, 2006·6 cites·61 claims
- 1352US2008063505A1Chip Packaging Systems and MethodsHONEYWELL INT INC·Filed 2007·Application pending·0 cites
- 1447US2006214247A1Getter deposition for vacuum packagingHONEYWELL INT INC·Filed 2006·Application pending·0 cites
- 1546US7800190B2Getter on die in an upper sense plate designed systemHONEYWELL INT INC·Filed 2008·Granted Sep 21, 2010·0 cites·13 claims
- 1646US2010020517A1Mems bump pattern die alignment systems and methodsHONEYWELL INT INC·Filed 2008·Application pending·0 cites
- 1743US2009014499A1Automated preform attach for vacuum packagingHONEYWELL INT INC·Filed 2007·Application pending·0 cites
- 1840US2005253283A1Getter deposition for vacuum packagingDCAMP JON B·Filed 2004·Application pending·0 cites
- 1940US2007114643A1Mems flip-chip packagingHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 2036US2011227173A1Mems sensor with integrated asic packagingHONEYWELL INT INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →