Chip Packaging Systems and Methods

Abstract

An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

1 - 27 . (canceled)  
   
   
       28 . A vacuum chamber comprising: 
 a first chamber;    a second chamber, wherein the first chamber is separated from the second chamber by a chamber divider, wherein the chamber divider can be selectively opened and closed;    the first chamber having a heater for heating the first chamber to a first temperature; and    the second chamber having a lid handler, wherein the lid handler has a heater.    
   
   
       29 . The vacuum chamber of  claim 28  wherein the first chamber and the second chamber can be pumped down to different vacuum levels when the chamber divider is closed.  
   
   
       30 . The vacuum chamber of  claim 28  wherein the first chamber and the second chamber can be raised to different temperatures when the chamber divider is closed.  
   
   
       31 . The vacuum chamber of  claim 28  wherein the first chamber is adapted to receive one or more chip carrier assemblies, and the vacuum chamber includes a mechanism to move the one or more chip carrier assemblies from the first chamber to the second chamber when the chamber divider is open.  
   
   
       32 . A vacuum chamber comprising: 
 a chamber heater for raising the temperature of the vacuum chamber; and    a lid handler for holding one or more lids, wherein the lid handler includes a heater for heating the one or more lids.    
   
   
       33 . The vacuum chamber of  claim 32  wherein the vacuum chamber is adapted to receive one or more chip carriers, and wherein the lid handler is adapted to move the one or more lids to engage the one or more chip carriers.  
   
   
       34 . The vacuum chamber of  claim 32 , wherein the vacuum chamber is adapted to only receive two or fewer packaged devices to reduce vacuum pump down times for the vacuum chamber.  
   
   
       35 . The vacuum chamber of  claim 32 , wherein the vacuum chamber is adapted to only receive one packaged device to reduce vacuum pump down times for the vacuum chamber.  
   
   
       36 . A vacuum chamber comprising: 
 a lid handler for holding one or more lids, wherein the lid handler includes a heater for heating the one or more lids to a getter activation temperature, and for heating the vacuum chamber to a lid sealing temperature; and    a controller for controlling the heater to heat the one or more lids to the getter activation temperature, and to heat the vacuum chamber to the lid sealing temperature.    
   
   
       37 . The vacuum chamber of  claim 36  wherein the controller is further adapted to control the heater to heat the vacuum chamber to a bake out temperature.  
   
   
       38 . The vacuum chamber of  claim 36  wherein the controller is adapted to first heat the one or more lids to the getter activation temperature, and then to heat the vacuum chamber to the lid sealing temperature.  
   
   
       39 . The vacuum chamber of  claim 36  wherein the controller is adapted to first heat the vacuum chamber to the lid sealing temperature, and then to heat the one or more lids to the getter activation temperature.  
   
   
       40 . The vacuum chamber of  claim 36  wherein the vacuum chamber is adapted to receive one or more chip carriers, and wherein the lid handler is adapted to move the one or more lids to engage the one or more chip carriers.