Inventor · disambiguated record
John C. Decker
Also filed as: DECKER JOHN · DECKER JOHN C
5 granted patents·3 pending applications·2 citations·filing 2019–2025
66Inventor score
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0188US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 0284US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0383US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0481US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 0575US11688634B2Trenches in wafer level packages for improvements in warpage reliability and thermalsINTEL CORP·Filed 2019·Granted Jun 27, 2023·2 cites·27 claims
- 0665US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 0753US11749585B2High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit packageINTEL CORP·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 0850US2024321807A1Barrier dispensing combined with non-conductive paste to enable packages with restricted underfill areasINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →