Inventor · disambiguated record
John H. Epple
Also filed as: EPPLE JOHN H
5 granted patents·2 pending applications·55 citations·filing 2003–2020
81Inventor score
Top patents by PatentIndex Score
7 records- 0197US9041146B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 26, 2015·30 cites·24 claims
- 0291US9997563B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2017·Granted Jun 12, 2018·8 cites·24 claims
- 0386US9660181B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2013·Granted May 23, 2017·7 cites·24 claims
- 0484US10644064B2Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2018·Granted May 5, 2020·4 cites·20 claims
- 0568US2020227472A1Logic chip including embedded magnetic tunnel junctionsINTEL CORP·Filed 2020·Application pending·0 cites
- 0657US7407863B2Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductorsUNIV ILLINOIS·Filed 2003·Granted Aug 5, 2008·6 cites·63 claims
- 0750US2008296619A1Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductorsUNIV ILLINOIS·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →