Inventor · disambiguated record
Joseph Fjelstad
Also filed as: FJELSTAD JOSEPH · FJELSTAD JOSEPH C · FJELSTAD JOSEPH CHARLES
187 granted patents·33 pending applications·11,172 citations·filing 1982–2019
99Inventor score
Files withTESSERA INC115FJELSTAD JOSEPH C17INTERCONNECT PORTFOLIO LLC15FJELSTAD JOSEPH CHARLES11OCCAM PORTFOLIO LLC10
Top patents by PatentIndex Score
220 records- 0199US7872344B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Jan 18, 2011·64 cites·21 claims
- 0299US6001671AMethods for manufacturing a semiconductor package having a sacrificial layerTESSERA INC·Filed 1996·Granted Dec 14, 1999·712 cites·44 claims
- 0399US5802699AMethods of assembling microelectronic assembly with socket for engaging bump leadsTESSERA INC·Filed 1994·Granted Sep 8, 1998·434 cites·30 claims
- 0499US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 0598US7737545B2Multi-surface IC packaging structures and methods for their manufactureINTERCONNECT PORTFOLIO LLC·Filed 2006·Granted Jun 15, 2010·102 cites·22 claims
- 0698US7408260B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Aug 5, 2008·52 cites·23 claims
- 0798US6847101B2Microelectronic package having a compliant layer with bumped protrusionsTESSERA INC·Filed 2002·Granted Jan 25, 2005·129 cites·47 claims
- 0898US6774317B2Connection components with postsTESSERA INC·Filed 2002·Granted Aug 10, 2004·93 cites·11 claims
- 0998US6586955B2Methods and structures for electronic probing arraysTESSERA INC·Filed 2001·Granted Jul 1, 2003·137 cites·65 claims
- 1098US6583444B2Semiconductor packages having light-sensitive chipsTESSERA INC·Filed 1998·Granted Jun 24, 2003·270 cites·6 claims
- 1198US6294830B1Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layerTESSERA INC·Filed 1999·Granted Sep 25, 2001·302 cites·9 claims
- 1298US6211572B1Semiconductor chip package with fan-in leadsTESSERA INC·Filed 1996·Granted Apr 3, 2001·282 cites·21 claims
- 1398US6177636B1Connection components with postsTESSERA INC·Filed 1997·Granted Jan 23, 2001·305 cites·7 claims
- 1498US5632631AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1994·Granted May 27, 1997·280 cites·13 claims
- 1597US8338713B2Cabled signaling system and components thereofFJELSTAD JOSEPH C·Filed 2007·Granted Dec 25, 2012·84 cites·18 claims
- 1697US7307293B2Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal pathsSILICON PIPE INC·Filed 2003·Granted Dec 11, 2007·102 cites·21 claims
- 1797US6856235B2Methods for manufacturing resistors using a sacrificial layerTESSERA INC·Filed 2001·Granted Feb 15, 2005·129 cites·6 claims
- 1897US6499216B1Methods and structures for electronic probing arraysTESSERA INC·Filed 1999·Granted Dec 31, 2002·134 cites·11 claims
- 1997US6133072AMicroelectronic connector with planar elastomer socketsTESSERA INC·Filed 1997·Granted Oct 17, 2000·233 cites·33 claims
- 2097US5989936AMicroelectronic assembly fabrication with terminal formation from a conductive layerTESSERA INC·Filed 1997·Granted Nov 23, 1999·215 cites·28 claims
- 2197US5980270ASoldering with resilient contactsTESSERA INC·Filed 1996·Granted Nov 9, 1999·249 cites·34 claims
- 2297US5615824ASoldering with resilient contactsTESSERA INC·Filed 1995·Granted Apr 1, 1997·217 cites·15 claims
- 2396US7652381B2Interconnect system without through-holesINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Jan 26, 2010·52 cites·28 claims
- 2496US7651382B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrityINTERCONNECT PORTFOLIO LLC·Filed 2008·Granted Jan 26, 2010·60 cites·14 claims
- 2596US7613011B2Signal-segregating connector systemINTERCONNECT PORTFOLIO LLC·Filed 2007·Granted Nov 3, 2009·45 cites·15 claims
- 2696US7528008B2Method of electrically connecting a microelectronic componentTESSERA INC·Filed 2006·Granted May 5, 2009·25 cites·6 claims
- 2796US7205613B2Insulating substrate for IC packages having integral ESD protectionSILICON PIPE·Filed 2005·Granted Apr 17, 2007·66 cites·17 claims
- 2896US6826827B1Forming conductive posts by selective removal of conductive materialTESSERA INC·Filed 2000·Granted Dec 7, 2004·51 cites·28 claims
- 2996US6690186B2Methods and structures for electronic probing arraysTESSERA INC·Filed 2001·Granted Feb 10, 2004·85 cites·7 claims
- 3096US6284563B1Method of making compliant microelectronic assembliesTESSERA INC·Filed 1998·Granted Sep 4, 2001·135 cites·33 claims
- 3196US6239384B1Microelectric lead structures with plural conductorsTESSERA INC·Filed 1998·Granted May 29, 2001·234 cites·35 claims
- 3296US6205660B1Method of making an electronic contactTESSERA INC·Filed 1997·Granted Mar 27, 2001·152 cites·15 claims
- 3396US6093584AMethod for encapsulating a semiconductor package having apertures through a sacrificial layer and contact padsTESSERA INC·Filed 1998·Granted Jul 25, 2000·157 cites·3 claims
- 3496US6086386AFlexible connectors for microelectronic elementsTESSERA INC·Filed 1997·Granted Jul 11, 2000·248 cites·46 claims
- 3596US6007349AFlexible contact post and post socket and associated methods thereforTESSERA INC·Filed 1997·Granted Dec 28, 1999·125 cites·53 claims
- 3696US5834339AMethods for providing void-free layers for semiconductor assembliesTESSERA INC·Filed 1996·Granted Nov 10, 1998·143 cites·93 claims
- 3796US5812378AMicroelectronic connector for engaging bump leadsTESSERA INC·Filed 1995·Granted Sep 22, 1998·239 cites·60 claims
- 3895US7278855B2High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureSILICON PIPE INC·Filed 2005·Granted Oct 9, 2007·31 cites·24 claims
- 3995US6324754B1Method for fabricating microelectronic assembliesTESSERA INC·Filed 1998·Granted Dec 4, 2001·164 cites·26 claims
- 4095US6130116AMethod of encapsulating a microelectronic assembly utilizing a barrierTESSERA INC·Filed 1997·Granted Oct 10, 2000·148 cites·14 claims
- 4195US6002168AMicroelectronic component with rigid interposerTESSERA INC·Filed 1997·Granted Dec 14, 1999·204 cites·48 claims
- 4294US7227759B2Signal-segregating connector systemSILICON PIPE INC·Filed 2005·Granted Jun 5, 2007·46 cites·17 claims
- 4394US7138299B2Method of electrically connecting a microelectronic componentTESSERA INC·Filed 2004·Granted Nov 21, 2006·34 cites·6 claims
- 4494US6848173B2Microelectric packages having deformed bonded leads and methods thereforTESSERA INC·Filed 2001·Granted Feb 1, 2005·82 cites·22 claims
- 4594US6821815B2Method of assembling a semiconductor chip packageTESSERA INC·Filed 2003·Granted Nov 23, 2004·66 cites·55 claims
- 4694US6274820B1Electrical connections with deformable contactsTESSERA INC·Filed 2000·Granted Aug 14, 2001·52 cites·41 claims
- 4794US5776796AMethod of encapsulating a semiconductor packageTESSERA INC·Filed 1996·Granted Jul 7, 1998·173 cites·47 claims
- 4893US7531894B2Method of electrically connecting a microelectronic componentTESSERA INC·Filed 2005·Granted May 12, 2009·17 cites·16 claims
- 4993US7280372B2Stair step printed circuit board structures for high speed signal transmissionsSILICON PIPE·Filed 2004·Granted Oct 9, 2007·78 cites·19 claims
- 5093US7095054B2Semiconductor package having light sensitive chipsTESSERA INC·Filed 2004·Granted Aug 22, 2006·55 cites·16 claims
Showing the top 50 of 220 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →