Inventor · disambiguated record
John Grunwald
Also filed as: GRUNWALD JOHN · GRUNWALD JOHN J
29 granted patents·12 pending applications·977 citations·filing 1973–2013
97Inventor score
Top patents by PatentIndex Score
41 records- 0196US4265943AMethod and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ionsMACDERMID INC·Filed 1978·Granted May 5, 1981·338 cites·18 claims
- 0294US6875097B2Fixed abrasive CMP pad with built-in additivesJ G SYSTEMS INC·Filed 2003·Granted Apr 5, 2005·52 cites·12 claims
- 0394US5641608ADirect imaging process for forming resist pattern on a surface and use thereof in fabricating printing platesMACDERMID INC·Filed 1995·Granted Jun 24, 1997·167 cites·22 claims
- 0492US4209331AElectroless copper composition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1978·Granted Jun 24, 1980·49 cites·20 claims
- 0590US4279948AElectroless copper deposition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1979·Granted Jul 21, 1981·44 cites·15 claims
- 0682US3959523AAdditive printed circuit boards and method of manufactureMACDERMID INC·Filed 1973·Granted May 25, 1976·30 cites·6 claims
- 0781US4608275AOxidizing acceleratorMACDERMID INC·Filed 1985·Granted Aug 26, 1986·43 cites·14 claims
- 0880US5895581ALaser imaging of printed circuit patterns without using phototoolsJ G SYSTEMS INC·Filed 1997·Granted Apr 20, 1999·48 cites·19 claims
- 0980US4110147AProcess of preparing thermoset resin substrates to improve adherence of electrolessly plated metal depositsMACDERMID INC·Filed 1977·Granted Aug 29, 1978·35 cites·5 claims
- 1080US3978252AMethod of improving the adhesion between a molded resin substrate and a metal film deposited thereonMACDERMID INC·Filed 1975·Granted Aug 31, 1976·30 cites·11 claims
- 1175US4701390AThermally stabilized photoresist imagesMACDERMID INC·Filed 1985·Granted Oct 20, 1987·28 cites·15 claims
- 1273US4800132AMechanical plating with oxidation-prone metalsMACDERMID INC·Filed 1987·Granted Jan 24, 1989·27 cites·18 claims
- 1365US6896710B2Abrasives for CMP applicationsJ G SYSTEMS INC·Filed 2003·Granted May 24, 2005·9 cites·4 claims
- 1462US7148147B2CMP composition containing organic nitro compoundsJ G SYSTEMS INC·Filed 2005·Granted Dec 12, 2006·1 cites·6 claims
- 1562US6599563B2Method and apparatus for improving interfacial chemical reactions in electroless depositions of metalsJ G SYSTEMS INC·Filed 2002·Granted Jul 29, 2003·4 cites·12 claims
- 1659US6524490B1Method for electroless copper deposition using a hypophosphite reducing agentJ G SYSTEMS INC·Filed 2000·Granted Feb 25, 2003·3 cites·16 claims
- 1754US2013344235A1Autocatalytic electroless copper using hypophosphite reducerJ G SYSTEMS INC·Filed 2013·Application pending·0 cites
- 1852US2010040773A1Method and Composition to Repair Pinholes and Microvoids in Immersion Silver Plated PWB's Thereby Relieving Creep CorrosionGRUNWALD JOHN J·Filed 2009·Application pending·0 cites
- 1950US7247557B2Method and composition to minimize dishingJ G SYSTEMS INC·Filed 2004·Granted Jul 24, 2007·2 cites·13 claims
- 2049US4762768AThermally stabilized photoresist imagesMACDERMID INC·Filed 1986·Granted Aug 9, 1988·10 cites·16 claims
- 2148US5342734ADeep UV sensitive photoresist resistant to latent image decayMORTON INT INC·Filed 1992·Granted Aug 30, 1994·10 cites·20 claims
- 2247US6998066B2CMP composition containing organic nitro compoundsJ G SYSTEMS INC·Filed 2003·Granted Feb 14, 2006·1 cites·2 claims
- 2347US6955586B2CMP composition and processJ G SYSTEMS INC·Filed 2003·Granted Oct 18, 2005·1 cites·3 claims
- 2447US5620612AMethod for the manufacture of printed circuit boardsMACDERMID INC·Filed 1995·Granted Apr 15, 1997·12 cites·8 claims
- 2547US2003233960A1Method for electroless plating without precious metal sensitizationFiled 2002·Application pending·0 cites
- 2645US2002086102A1Method and apparatus for improving interfacial chemical reactions in electroless depositions of metalsFiled 2001·Application pending·0 cites
- 2745US2003173226A1Metallization of optical fibersFiled 2003·Application pending·0 cites
- 2844US2004175938A1Method for metalizing wafersFiled 2004·Application pending·0 cites
- 2943US2004154929A1Electroless copper plating of electronic device componentsFiled 2003·Application pending·0 cites
- 3043US2004234777A1Method for electroless plating without precious metal sensitizationFiled 2004·Application pending·0 cites
- 3142US2010215840A1METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR SnJ G SYSTEMS INC·Filed 2010·Application pending·0 cites
- 3241US4950504AMechanical plating with oxidation-prone metalsMACDERMID INC·Filed 1989·Granted Aug 21, 1990·9 cites·35 claims
- 3340US6805911B2Method and apparatus for improving interfacial chemical reactionsJ G SYSTEMS INC·Filed 2003·Granted Oct 19, 2004·0 cites·4 claims
- 3440US5290608AMethod for forming a patterned maskMACDERMID INC·Filed 1993·Granted Mar 1, 1994·9 cites·15 claims
- 3540US2003161602A1Emulsions and microemulsions for use in processing and repairing optical fibersFiled 2003·Application pending·0 cites
- 3638US2004172886A1CMP composition based on cupric oxidizing compoundsFiled 2003·Application pending·0 cites
- 3738US2004256055A1CMP pad with long user lifeFiled 2003·Application pending·0 cites
- 3834US4775601AMechanical galvanizing coating resistant to chipping, flaking and crackingMACDERMID INC·Filed 1987·Granted Oct 4, 1988·4 cites·9 claims
- 3934US4100312AMethod of making metal-plastic laminatesMACDERMID INC·Filed 1976·Granted Jul 11, 1978·9 cites·11 claims
- 4029US4724168AMechanical galvanizing coating resistant to chipping, flaking and, crackingMACDERMID INC·Filed 1986·Granted Feb 9, 1988·2 cites·39 claims
- 4125US6632588B2Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing platesFiled 2002·Granted Oct 14, 2003·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →