Inventor · disambiguated record
Jodi Grzeskowiak
Also filed as: GRZESKOWIAK JODI
17 granted patents·11 pending applications·30 citations·filing 2019–2024
88Inventor score
Files withTOKYO ELECTRON LTD28
Top patents by PatentIndex Score
28 records- 0197US11264274B2Reverse contact and silicide process for three-dimensional logic devicesTOKYO ELECTRON LTD·Filed 2020·Granted Mar 1, 2022·5 cites·20 claims
- 0296US10770479B2Three-dimensional device and method of forming the sameTOKYO ELECTRON LTD·Filed 2019·Granted Sep 8, 2020·20 cites·20 claims
- 0391US11682559B2Method to form narrow slot contactsTOKYO ELECTRON LTD·Filed 2021·Granted Jun 20, 2023·2 cites·20 claims
- 0490US11342427B23D directed self-assembly for nanostructuresTOKYO ELECTRON LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0579US11322401B2Reverse contact and silicide process for three-dimensional semiconductor devicesTOKYO ELECTRON LTD·Filed 2020·Granted May 3, 2022·1 cites·20 claims
- 0674US12099299B2Method of patterning a substrate using a sidewall spacer etch maskTOKYO ELECTRON LTD·Filed 2023·Granted Sep 24, 2024·0 cites·10 claims
- 0772US12488989B2Method to form narrow slot contactsTOKYO ELECTRON LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0864US2025298316A1Autocatalytic acid amplification for photoselective acid diffusionTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0964US2024419074A1Formation of sub-lithographic mandrel patterns using reversible overcoatTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1064US2025298319A1Photoresist patterning using planar trim layerTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1163US11782346B2Method of patterning a substrate using a sidewall spacer etch maskTOKYO ELECTRON LTD·Filed 2020·Granted Oct 10, 2023·0 cites·10 claims
- 1260US2025029837A1Methods and compositions for trench formation using advanced track-based patterning processesTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1358US2025306468A1Multipatterning with crosslinkable overcoatTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1457US2025300010A1Method for patterning for chemical mechanical polishing (cmp) iso-dense bias compensation using z-heightTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1557US2025306463A1Patterning a substrate using a multi-patterning techniqueTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1655US12451354B2Double patterning method of patterning a substrateTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·16 claims
- 1753US11450562B2Method of bottom-up metallization in a recessed featureTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·0 cites·19 claims
- 1853US2024085795A1Patterning a semiconductor workpieceTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1952US11393694B2Method for planarization of organic filmsTOKYO ELECTRON LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 2052US2021294148A1Planarizing Organic FilmsTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2152US2023290676A1Self Aligned Multiple Patterning MethodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2251US11841617B2Method of forming a narrow trenchTOKYO ELECTRON LTD·Filed 2020·Granted Dec 12, 2023·0 cites·20 claims
- 2350US11201051B2Method for layer by layer growth of conformal filmsTOKYO ELECTRON LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 2449US11335566B2Method for planarization of spin-on and CVD-deposited organic filmsTOKYO ELECTRON LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 2549US2023052800A1Methods of Forming PatternsTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2648US11990334B2Method for tuning stress transitions of films on a substrateTOKYO ELECTRON LTD·Filed 2020·Granted May 21, 2024·0 cites·15 claims
- 2748US11656550B2Controlling semiconductor film thicknessTOKYO ELECTRON LTD·Filed 2020·Granted May 23, 2023·0 cites·21 claims
- 2847US11417526B2Multiple patterning processesTOKYO ELECTRON LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →