Inventor · disambiguated record
Jong-Woo Ha
Also filed as: HA JONG-WOO
56 granted patents·6 pending applications·627 citations·filing 2005–2023
98Inventor score
Top patents by PatentIndex Score
62 records- 0198US7288835B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 30, 2007·135 cites·17 claims
- 0296US7368319B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 6, 2008·70 cites·20 claims
- 0394US8067268B2Stacked integrated circuit package system and method for manufacturing thereofCARSON FLYNN·Filed 2010·Granted Nov 29, 2011·26 cites·15 claims
- 0493US9330945B2Integrated circuit package system with multi-chip moduleSONG SUNGMIN·Filed 2007·Granted May 3, 2016·33 cites·14 claims
- 0593US7420269B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Sep 2, 2008·34 cites·18 claims
- 0692US7750454B2Stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·21 cites·5 claims
- 0791US7888184B2Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 15, 2011·17 cites·10 claims
- 0890US7687897B2Mountable integrated circuit package-in-package system with adhesive spacing structuresSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·19 cites·20 claims
- 0989US8957530B2Integrated circuit packaging system with embedded circuitry and postSHIM IL KWON·Filed 2011·Granted Feb 17, 2015·9 cites·10 claims
- 1089US8531043B2Planar encapsulation and mold cavity package in package systemHA JONG-WOO·Filed 2008·Granted Sep 10, 2013·18 cites·18 claims
- 1189US7659609B2Integrated circuit package-in-package system with carrier interposerSTATS CHIPPAC LTD·Filed 2007·Granted Feb 9, 2010·19 cites·18 claims
- 1289US7501697B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 10, 2009·16 cites·9 claims
- 1388US7498667B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 3, 2009·20 cites·20 claims
- 1487US7456088B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2006·Granted Nov 25, 2008·13 cites·10 claims
- 1586US7927917B2Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 19, 2011·13 cites·20 claims
- 1686US7652376B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2008·Granted Jan 26, 2010·11 cites·9 claims
- 1785US8241955B2Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Aug 14, 2012·6 cites·20 claims
- 1884US9355962B2Integrated circuit package stacking system with redistribution and method of manufacture thereofLEE SEONGMIN·Filed 2009·Granted May 31, 2016·12 cites·9 claims
- 1984US8405197B2Integrated circuit packaging system with stacked configuration and method of manufacture thereofHA JONG-WOO·Filed 2009·Granted Mar 26, 2013·12 cites·20 claims
- 2084US7872340B2Integrated circuit package system employing an offset stacked configurationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·10 cites·18 claims
- 2180US8692388B2Integrated circuit package system with waferscale spacerLEE SANG-HO·Filed 2012·Granted Apr 8, 2014·4 cites·9 claims
- 2280US7279785B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2005·Granted Oct 9, 2007·9 cites·16 claims
- 2379US11679527B2Manufacturing method of ceramic chipsROOTS CO LTD·Filed 2020·Granted Jun 20, 2023·2 cites·6 claims
- 2479US8383458B2Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·4 cites·15 claims
- 2579US7968373B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 28, 2011·8 cites·20 claims
- 2678US8810018B2Stacked integrated circuit package system with face to face stack configurationHA JONG-WOO·Filed 2006·Granted Aug 19, 2014·8 cites·10 claims
- 2777US7635913B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 22, 2009·7 cites·30 claims
- 2876US7772683B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 10, 2010·7 cites·17 claims
- 2976US7755180B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jul 13, 2010·5 cites·17 claims
- 3075US7915724B2Integrated circuit packaging system with base structure deviceSTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·6 cites·20 claims
- 3175US7884460B2Integrated circuit packaging system with carrier and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 8, 2011·5 cites·8 claims
- 3273US7741154B2Integrated circuit package system with stacking moduleSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·5 cites·20 claims
- 3373US7674640B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2007·Granted Mar 9, 2010·5 cites·14 claims
- 3472US7951643B2Integrated circuit packaging system with lead frame and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 3572US7829986B2Integrated circuit package system with net spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 9, 2010·5 cites·20 claims
- 3671US9236319B2Stacked integrated circuit package systemHA JONG-WOO·Filed 2008·Granted Jan 12, 2016·5 cites·16 claims
- 3770US9230898B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSHIN HANGIL·Filed 2009·Granted Jan 5, 2016·4 cites·18 claims
- 3870US8039365B2Integrated circuit package system including wafer level spacerSTATS CHIPPAC LTD·Filed 2006·Granted Oct 18, 2011·4 cites·19 claims
- 3969US8617924B2Stacked integrated circuit package-in-package system and method of manufacture thereofKIM OHSUG·Filed 2009·Granted Dec 31, 2013·4 cites·16 claims
- 4069US8211746B2Integrated circuit packaging system with lead frame and method of manufacture thereofHA JONG-WOO·Filed 2011·Granted Jul 3, 2012·2 cites·20 claims
- 4164US7812435B2Integrated circuit package-in-package system with side-by-side and offset stackingSTATS CHIPPAC LTD·Filed 2007·Granted Oct 12, 2010·2 cites·17 claims
- 4263US8823160B2Integrated circuit package system having cavityHA JONG-WOO·Filed 2008·Granted Sep 2, 2014·2 cites·20 claims
- 4363US8143104B2Method for manufacturing ball grid array package stacking systemHA JONG-WOO·Filed 2011·Granted Mar 27, 2012·1 cites·10 claims
- 4462US8642383B2Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wiresHA JONG-WOO·Filed 2006·Granted Feb 4, 2014·2 cites·5 claims
- 4560US8039942B2Ball grid array package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Oct 18, 2011·1 cites·10 claims
- 4660US7994625B2Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·2 cites·20 claims
- 4753US12426407B2Method of manufacturing a fluorescent substanceROOTS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·9 claims
- 4853US2016036928A1Method and apparatus for providing internet service in mobile communication terminalSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 4950US8211749B2Integrated circuit package system with waferscale spacerLEE SANG-HO·Filed 2006·Granted Jul 3, 2012·0 cites·10 claims
- 5050US8049322B2Integrated circuit package-in-package system and method for making thereofSTATS CHIPPAC LTD·Filed 2010·Granted Nov 1, 2011·0 cites·14 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →