Inventor · disambiguated record
Josef Hoeglauer
Also filed as: HOEGLAUER JOSEF
79 granted patents·13 pending applications·371 citations·filing 2006–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AG31INFINEON TECHNOLOGIES AUSTRIA AG25OTREMBA RALF16INFINEON TECHNOLOGIES AUSTRIA10LANDAU STEFAN2
Top patents by PatentIndex Score
92 records- 0198US9331060B2Device including two power semiconductor chips and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 3, 2016·48 cites·8 claims
- 0297US8698293B2Multi-chip package and method of manufacturing thereofOTREMBA RALF·Filed 2012·Granted Apr 15, 2014·40 cites·30 claims
- 0395US8975711B2Device including two power semiconductor chips and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 10, 2015·22 cites·26 claims
- 0495US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 0590US7969018B2Stacked semiconductor chips with separate encapsulationsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·22 cites·20 claims
- 0689US7851908B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·19 cites·17 claims
- 0787US9515060B2Multi-chip semiconductor power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Dec 6, 2016·7 cites·16 claims
- 0886US8227908B2Electronic device having contact elements with a specified cross section and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Jul 24, 2012·11 cites·16 claims
- 0986US7821128B2Power semiconductor device having lines within a housingINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 26, 2010·15 cites·22 claims
- 1085US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 1185US7626262B2Electrically conductive connection, electronic component and method for their productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 1, 2009·13 cites·12 claims
- 1283US7872350B2Multi-chip moduleQIMONDA AG·Filed 2007·Granted Jan 18, 2011·12 cites·17 claims
- 1381US8975117B2Semiconductor device using diffusion solderingOTREMBA RALF·Filed 2012·Granted Mar 10, 2015·7 cites·15 claims
- 1481US7807504B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 5, 2010·7 cites·8 claims
- 1580US12087740B2Method of forming a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1679US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 1779US11302610B2Semiconductor package and method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Apr 12, 2022·2 cites·8 claims
- 1879US8871630B2Manufacturing electronic device having contact elements with a specified cross sectionOTREMBA RALF·Filed 2012·Granted Oct 28, 2014·4 cites·7 claims
- 1979US2024413127A1Method of Forming a Semiconductor ModuleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2078US9147631B2Semiconductor power device having a heat sinkINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 29, 2015·4 cites·18 claims
- 2178US7879652B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·6 cites·11 claims
- 2277US9806029B2Transistor arrangement with semiconductor chips between two substratesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Oct 31, 2017·4 cites·20 claims
- 2377US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 2477US8637341B2Semiconductor moduleOTREMBA RALF·Filed 2008·Granted Jan 28, 2014·7 cites·16 claims
- 2576US9018744B2Semiconductor device having a clip contactINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 28, 2015·4 cites·26 claims
- 2676US8334586B2Stacked semiconductor chips with separate encapsulationsOTREMBA RALF·Filed 2011·Granted Dec 18, 2012·4 cites·19 claims
- 2775US7528010B2Semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 5, 2009·5 cites·10 claims
- 2873US8164173B2Panel, semiconductor device and method for the production thereofKOLLER ADOLF·Filed 2010·Granted Apr 24, 2012·3 cites·13 claims
- 2972US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 3072US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 3172US8643176B2Power semiconductor chip having two metal layers on one faceOTREMBA RALF·Filed 2011·Granted Feb 4, 2014·3 cites·24 claims
- 3272US7632759B2Semiconductor device with front side metallization and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 15, 2009·5 cites·25 claims
- 3371US11817430B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 3471US7772693B2Panel, semiconductor device and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·4 cites·30 claims
- 3570US10833583B2Methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 3670US8896106B2Semiconductor packages having multiple lead frames and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 3769US9184066B2Chip arrangements and methods for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 10, 2015·2 cites·33 claims
- 3869US9059155B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 3969US8686569B2Die arrangement and method of forming a die arrangementDAECHE FRANK·Filed 2010·Granted Apr 1, 2014·4 cites·15 claims
- 4069US7589413B2Semiconductor device comprising a vertical semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 15, 2009·4 cites·29 claims
- 4167US10224912B2Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 5, 2019·1 cites·17 claims
- 4267US9099441B2Power transistor arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·2 cites·15 claims
- 4366US11776882B2Method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Oct 3, 2023·0 cites·22 claims
- 4466US9230880B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 5, 2016·1 cites·20 claims
- 4566US8084816B2Semiconductor moduleOTREMBA RALF·Filed 2009·Granted Dec 27, 2011·2 cites·13 claims
- 4665US8987880B2Chip module and a method for manufacturing a chip moduleHOEGLAUER JOSEF·Filed 2012·Granted Mar 24, 2015·2 cites·12 claims
- 4764US9437548B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 4863US9362240B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 4963US8461645B2Power semiconductor deviceOTREMBA RALF·Filed 2011·Granted Jun 11, 2013·2 cites·23 claims
- 5062US11978692B2Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 7, 2024·0 cites·12 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Josef Hoeglauer files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →