Inventor · disambiguated record
Josef Höglauer
Also filed as: HOEGLAUER JOSEF · HOGLAUER JOSEF · HÖGLAUER JOSEF
14 granted patents·7 pending applications·20 citations·filing 2005–2025
87Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG7INFINEON TECHNOLOGIES AG6INFINEON TECHNOLOGIES AUSTRIA6HOEGLAUER JOSEF1KNOTT BERNHARD1
Top patents by PatentIndex Score
21 records- 0173US9437516B2Chip-embedded packages with backside die connectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Sep 6, 2016·3 cites·20 claims
- 0269US8169285B2Semiconductor device with integrated coilsHOEGLAUER JOSEF·Filed 2007·Granted May 1, 2012·5 cites·26 claims
- 0367US12264867B2Cryostat socket for holding an ion trap device mounted on a substrate in a cryostatINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Apr 1, 2025·0 cites·15 claims
- 0467US9196554B2Electronic component, arrangement and methodINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 24, 2015·2 cites·18 claims
- 0567US9196577B2Semiconductor packaging arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 0665US9312760B2Switched-mode power converter with split partitioningINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Apr 12, 2016·2 cites·19 claims
- 0761US9123701B2Semiconductor die and package with source down and sensing configurationINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 1, 2015·2 cites·20 claims
- 0861US9041170B2Multi-level semiconductor packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted May 26, 2015·1 cites·6 claims
- 0961US2025198686A1System including an ion trap device arranged on a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 1059US2025157895A1Leadframe package with increased routing capabilityINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1159US2025218914A1Package with component-carrying intermediate structure and additional carrier having reference potential structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1254US2024030200A1Semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1354US2023197577A1Semiconductor Devices Including a Premolded Leadframe and a Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1452US8149080B2Integrated circuit including inductive device and ferromagnetic materialKNOTT BERNHARD·Filed 2007·Granted Apr 3, 2012·1 cites·25 claims
- 1552US2024030111A1Semiconductor package and method for fabricating a semiconductor package for upright mountingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1651US7265564B2Method for testing a contact region of a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 4, 2007·2 cites·39 claims
- 1751US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1849US10109609B2Connection structure and electronic componentINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Oct 23, 2018·0 cites·25 claims
- 1947US8975735B2Redistribution board, electronic component and moduleINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 10, 2015·0 cites·20 claims
- 2044US9054040B2Multi-die package with separate inter-die interconnectsINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 9, 2015·0 cites·21 claims
- 2143US9099391B2Semiconductor package with top-side insulation layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →