Inventor · disambiguated record
Jong Wook Ju
Also filed as: JU JONG W · JU JONG WOOK
18 granted patents·3 pending applications·93 citations·filing 2004–2011
93Inventor score
Top patents by PatentIndex Score
21 records- 0193US7737539B2Integrated circuit package system including honeycomb moldingSTATS CHIPPAC LTD·Filed 2006·Granted Jun 15, 2010·30 cites·19 claims
- 0280US7443037B2Stacked integrated circuit package system with connection protectionSTATS CHIPPAC LTD·Filed 2006·Granted Oct 28, 2008·10 cites·20 claims
- 0377US7635913B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 22, 2009·7 cites·30 claims
- 0476US8569882B2Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereofKO WONJUN·Filed 2011·Granted Oct 29, 2013·5 cites·17 claims
- 0576US7772683B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 10, 2010·7 cites·17 claims
- 0674US8623704B2Adhesive/spacer island structure for multiple die packageLEE SANG HO·Filed 2006·Granted Jan 7, 2014·5 cites·14 claims
- 0771US8067831B2Integrated circuit package system with planar interconnectsKWON HYEOG CHAN·Filed 2005·Granted Nov 29, 2011·6 cites·20 claims
- 0869US8617924B2Stacked integrated circuit package-in-package system and method of manufacture thereofKIM OHSUG·Filed 2009·Granted Dec 31, 2013·4 cites·16 claims
- 0965US8632112B2Workpiece displacement systemKIM HYUNJOO·Filed 2006·Granted Jan 21, 2014·4 cites·19 claims
- 1065US8552551B2Adhesive/spacer island structure for stacking over wire bonded dieLEE SANG HO·Filed 2005·Granted Oct 8, 2013·3 cites·13 claims
- 1162US7763961B2Hybrid stacking package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 27, 2010·2 cites·8 claims
- 1261US8659175B2Integrated circuit package system with offset stackJU JONG WOOK·Filed 2007·Granted Feb 25, 2014·4 cites·19 claims
- 1359US8217501B2Integrated circuit package system including honeycomb moldingKWON HYEOG CHAN·Filed 2010·Granted Jul 10, 2012·1 cites·20 claims
- 1459US8143102B2Integrated circuit package system including die having relieved active regionDO BYUNG TAI·Filed 2008·Granted Mar 27, 2012·1 cites·20 claims
- 1557US8956914B2Integrated circuit package system with overhang dieYUN JA EUN·Filed 2007·Granted Feb 17, 2015·3 cites·16 claims
- 1645US8415204B2Integrated circuit packaging system with heat spreader and method of manufacture thereofYUN JAEUN·Filed 2009·Granted Apr 9, 2013·0 cites·20 claims
- 1744US8067275B2Integrated circuit package system with package integrationKO WONJUN·Filed 2007·Granted Nov 29, 2011·0 cites·20 claims
- 1844US7306971B2Semiconductor chip packaging method with individually placed film adhesive piecesCHIPPAC INC·Filed 2004·Granted Dec 11, 2007·1 cites·4 claims
- 1941US2005258527A1Adhesive/spacer island structure for multiple die packageCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2039US2012224332A1Integrated circuit packaging system with bump bonded dies and method of manufacture thereofYUN JAEUN·Filed 2011·Application pending·0 cites
- 2138US2005208700A1Die to substrate attach using printed adhesiveCHIPPAC INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →