Inventor · disambiguated record
Joachim Junge
Also filed as: JUNGE JOACHIM
5 granted patents·1 pending application·86 citations·filing 1989–2012
80Inventor score
Top patents by PatentIndex Score
6 records- 0182US6997779B2Device for the simultaneous double-side grinding of a workpiece in wafer formSILTRONIC AG·Filed 2005·Granted Feb 14, 2006·11 cites·10 claims
- 0276US6390896B1Method and device for cutting a multiplicity of disks from a hard brittle workpieceWACKER SILTRONIC HALBLEITERMAT·Filed 1999·Granted May 21, 2002·57 cites·8 claims
- 0371US7666064B2Method for grinding semiconductor wafersSILTRONIC AG·Filed 2008·Granted Feb 23, 2010·4 cites·15 claims
- 0461US8197300B2Simultaneous double-side grinding of semiconductor wafersJUNGE JOACHIM·Filed 2008·Granted Jun 12, 2012·3 cites·13 claims
- 0548US5030910AMethod and apparatus for slicing crystalline wafers aided by magnetic field monitoring meansWACKER CHEMITRONIC·Filed 1989·Granted Jul 9, 1991·11 cites·12 claims
- 0636US2013061842A1Single-layered winding of sawing wire with fixedly bonded abrasive grain for wire saws for slicing wafers from a workpieceJUNGE JOACHIM·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Joachim Junge files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →