Inventor · disambiguated record
Jong Hoon Kim
Also filed as: KIM JONG · KIM JONG H · KIM JONG HOON · KIM JONG-CHUL
212 granted patents·80 pending applications·1,148 citations·filing 1986–2025
99Inventor score
Files withSK HYNIX INC58SAMSUNG DISPLAY CO LTD35SAMSUNG ELECTRONICS CO LTD25KIM JONG-HOON24HYNIX SEMICONDUCTOR INC18
Top patents by PatentIndex Score
292 records- 0198US7446420B1Through silicon via chip stack package capable of facilitating chip selection during device operationHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Nov 4, 2008·93 cites·11 claims
- 0296US8804305B2Multilayer ceramic condenser and method for manufacturing the sameKIM HYUNG JOON·Filed 2011·Granted Aug 12, 2014·15 cites·6 claims
- 0396US8110910B2Stack packageKIM JONG HOON·Filed 2010·Granted Feb 7, 2012·32 cites·20 claims
- 0496US7589410B2Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 15, 2009·40 cites·15 claims
- 0595US9214410B2Stack packages and methods of fabricating the sameSK HYNIX INC·Filed 2014·Granted Dec 15, 2015·19 cites·18 claims
- 0695US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0794US11751420B2Display device capable of facilitating substrate bonding with alignment key and method of fabricating the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·16 claims
- 0893US11495545B2Semiconductor package including a bridge dieSK HYNIX INC·Filed 2020·Granted Nov 8, 2022·3 cites·10 claims
- 0993US6599929B21H-indole derivatives as a highly selective cyclooxygenase-2 inhibitorCHEIL JEDANG CORP·Filed 2002·Granted Jul 29, 2003·75 cites·3 claims
- 1093USD375186SMagnetic beltUNIDEX GROUP NC·Filed 1995·Granted Nov 5, 1996·66 cites·1 claims
- 1192US9508688B2Semiconductor packages with interposers and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted Nov 29, 2016·9 cites·19 claims
- 1291US12178068B2Method of fabricating display device capable of facilitating substrate bonding with alignment keySAMSUNG DISPLAY CO LTD·Filed 2023·Granted Dec 24, 2024·1 cites·6 claims
- 1391US11561919B2Memory controller, method of operating memory controller and storage deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·19 claims
- 1491US9906312B2Semiconductor packages with optical interconnection structures, memory cards including the same, and electronic systems including the sameSK HYNIX INC·Filed 2015·Granted Feb 27, 2018·8 cites·17 claims
- 1591US7994621B2Stacked semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Aug 9, 2011·20 cites·7 claims
- 1691US7859115B2Semiconductor package for improving characteristics for transmitting signals and powerHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·21 cites·11 claims
- 1791US7687698B2Apparatus for adjusting neck angle of guitarKIM JONG HOON·Filed 2009·Granted Mar 30, 2010·16 cites·9 claims
- 1890US9779202B2Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurementsKLA TENCOR CORP·Filed 2015·Granted Oct 3, 2017·9 cites·17 claims
- 1990US8018043B2Semiconductor package having side walls and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 13, 2011·13 cites·9 claims
- 2089US9911751B2Manufacturing method for semiconductor device having hole penetrating stack structureSK HYNIX INC·Filed 2016·Granted Mar 6, 2018·6 cites·12 claims
- 2188US11322446B2System-in-packages including a bridge dieSK HYNIX INC·Filed 2019·Granted May 3, 2022·5 cites·12 claims
- 2288US11092842B2Display panel and method of manufacturing wavelength conversion substrateSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Aug 17, 2021·2 cites·20 claims
- 2388US11075111B2Vertical semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2019·Granted Jul 27, 2021·4 cites·17 claims
- 2488US10658332B2Stack packages including bridge diesSK HYNIX INC·Filed 2018·Granted May 19, 2020·5 cites·20 claims
- 2587US11016328B2Display panel and color conversion panelSAMSUNG DISPLAY CO LTD·Filed 2019·Granted May 25, 2021·3 cites·21 claims
- 2687US10608324B2Electronic device comprising antennaSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 31, 2020·6 cites·16 claims
- 2787US9300288B2Touch sensor panel and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2013·Granted Mar 29, 2016·8 cites·14 claims
- 2887US8154135B2Stacked semiconductor packageKIM JONG HOON·Filed 2009·Granted Apr 10, 2012·15 cites·18 claims
- 2986US11908730B2Vertical semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 3085US9087333B2Method and system for monitoring quality of foodKIM BYEONG SAM·Filed 2011·Granted Jul 21, 2015·16 cites·9 claims
- 3185US7629956B2Apparatus and method for driving image display deviceLG DISPLAY CO LTD·Filed 2005·Granted Dec 8, 2009·7 cites·9 claims
- 3284US9922965B2Manufacturing methods semiconductor packages including through mold connectorsSK HYNIX INC·Filed 2017·Granted Mar 20, 2018·3 cites·11 claims
- 3384US9720499B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 1, 2017·10 cites·23 claims
- 3484US8462097B2Gate drive circuit having shift register in which plural stages are connected to each otherKIM KYUNG-WOOK·Filed 2009·Granted Jun 11, 2013·11 cites·14 claims
- 3583US12157265B2Coupler for air suspension and apparatus and method for manufacturing the sameHYUNDAI MOBIS CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·8 claims
- 3683US11903261B2Display device including color absorbing layer between capping and bank layers for improving color matching, and method of providing the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·17 claims
- 3783US9806015B1Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Oct 31, 2017·4 cites·20 claims
- 3883US9613972B1Method of manufacturing semiconductor deviceSK HYNIX INC·Filed 2016·Granted Apr 4, 2017·4 cites·14 claims
- 3983US7834836B2Flat display apparatus and picture quality controlling method thereofLG DISPLAY CO LTD·Filed 2006·Granted Nov 16, 2010·6 cites·22 claims
- 4083US7763498B2Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack packageHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Jul 27, 2010·9 cites·11 claims
- 4182US11664351B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 4282US8203204B2Stacked semiconductor packageKIM JONG HOON·Filed 2011·Granted Jun 19, 2012·5 cites·6 claims
- 4382US8026586B2Semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Sep 27, 2011·10 cites·19 claims
- 4482US7965530B2Memory modules and memory systems having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 21, 2011·14 cites·11 claims
- 4582US7646212B2Memory system including a power divider on a multi module memory busSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 12, 2010·13 cites·12 claims
- 4682US7495340B2Metal layer structure of semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Feb 24, 2009·10 cites·8 claims
- 4781US11600804B2Display panel including a capping layerSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Mar 7, 2023·1 cites·20 claims
- 4881US10603252B2Tooth-attachable patch capable of being removed by tooth brushingLG HOUSEHOLD & HEALTH CARE LTD·Filed 2016·Granted Mar 31, 2020·2 cites·18 claims
- 4981US8208338B2Semiconductor deviceKIM JONG-HOON·Filed 2010·Granted Jun 26, 2012·6 cites·10 claims
- 5081US7446405B2Wafer level chip scale package (WLCSP) with high reliability against thermal stressHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·5 claims
Showing the top 50 of 292 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →