Inventor · disambiguated record
Jong-Yeon Kim
Also filed as: KIM JONG YEON
9 granted patents·7 pending applications·163 citations·filing 2002–2025
88Inventor score
Top patents by PatentIndex Score
16 records- 0196US8816407B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·90 cites·20 claims
- 0293US8921918B2Three-dimensional semiconductor devicesSHIM JAE-JOO·Filed 2011·Granted Dec 30, 2014·22 cites·20 claims
- 0389US8643179B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageIM YUN-HYEOK·Filed 2011·Granted Feb 4, 2014·11 cites·22 claims
- 0481US7440779B2Radar detector having function of hands-free deviceBG T & A CO·Filed 2005·Granted Oct 21, 2008·10 cites·4 claims
- 0580US9076881B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 7, 2015·4 cites·13 claims
- 0674US8522115B2Flash memory device and memory system comprising sameKIM JU HYUNG·Filed 2010·Granted Aug 27, 2013·5 cites·18 claims
- 0771US6716738B2Method of fabricating multilayered UBM for flip chip interconnections by electroplatingKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Apr 6, 2004·19 cites·14 claims
- 0868US10690709B2System for monitoring resistance and current in ground lineSUNKWANG LIGHTING PROT TECHNICAL INSTITUTE INC·Filed 2017·Granted Jun 23, 2020·2 cites·4 claims
- 0958US2025022869A1Methods of manufacturing semiconductor die stack structuresSK HYNIX INC·Filed 2023·Application pending·0 cites
- 1057US2024395746A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2023·Application pending·0 cites
- 1156US2024120292A1Stack package including insert die for reinforcementSK HYNIX INC·Filed 2023·Application pending·0 cites
- 1253US2024186291A1Semiconductor die stack structureSK HYNIX INC·Filed 2023·Application pending·0 cites
- 1347US2025167123A1Semiconductor die having a metal plate layerSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1443US2013267558A1Pharmaceutical composition for treating or preventing alcoholic liver diseases, containing cilostazol as active ingredientKIM JONG-YEON·Filed 2011·Application pending·0 cites
- 1542US2007158391A1Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickelSON YOON-CHUL·Filed 2006·Application pending·0 cites
- 1627US9590418B2Apparatus for checking damage to surge protector and automatically changing surge protectorSUNKWANG LIGHTNING PROT TECHNICAL INST INC·Filed 2015·Granted Mar 7, 2017·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →