Inventor · disambiguated record
Joerg Krempel-Hesse
Also filed as: KREMPEL-HESSE JOERG
0 granted patents·12 pending applications·0 citations·filing 2007–2011
Top patents by PatentIndex Score
12 records- 0158US2009194027A1Twin-type coating device with improved separating plateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 0257US2011303149A1Twin-type coating device with improved separating plateHEIMEL OLIVER·Filed 2011·Application pending·0 cites
- 0353US2008173535A1Magnetron Sputtering Source, Sputter-Coating Installation, and Method for Coating a SubstrateAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 0450US2010181505A1Particle beam device with reduced emission of undesired materialAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0549US2011005924A1Target backing tube, cylindrical target, and cylindrical target assemblyAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0649US2010181187A1Charged particle beam pvd device, shielding device, coating chamber for coating substrates, and method of coatingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0749US2011005925A1Target backing tube, cylindrical target assembly and sputtering systemAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0849US2011005923A1Sputtering system, rotatable cylindrical target assembly, backing tube, target element and cooling shieldAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0947US2011303151A1Twin-type coating device with improved separating plateHEIMEL OLIVER·Filed 2011·Application pending·0 cites
- 1047US2011303150A1Twin-type coating device with improved separating plateHEIMEL OLIVER·Filed 2011·Application pending·0 cites
- 1144US2007240977A1Sputtering with cooled targetAPPLIED MATERIALS GMBH & CO KG·Filed 2007·Application pending·0 cites
- 1240US2011192716A1Method for producing an ito layer and sputtering systemAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →