Inventor · disambiguated record
John W. Lam
Also filed as: LAM JOHN · LAM JOHN W
5 granted patents·5 pending applications·8 citations·filing 2004–2017
71Inventor score
Top patents by PatentIndex Score
10 records- 0175US9496145B2Electrochemical plating methodsAPPLIED MATERIALS INC·Filed 2014·Granted Nov 15, 2016·3 cites·12 claims
- 0266US7770285B2Method of forming a magnetic read/write headHITACHI GLOBAL STORAGE TECH·Filed 2008·Granted Aug 10, 2010·4 cites·12 claims
- 0358US9758896B2Forming cobalt interconnections on a substrateAPPLIED MATERIALS INC·Filed 2015·Granted Sep 12, 2017·0 cites·8 claims
- 0457US2017159199A1Forming cobalt interconnections on a substrateAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 0550US9704717B2Electrochemical plating methodsAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 0647US2007020386A1Encapsulation of chemically amplified resist template for low pH electroplatingBEDELL DANIEL W·Filed 2005·Application pending·0 cites
- 0746US7459198B2Stress relief for electroplated filmsHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Dec 2, 2008·1 cites·25 claims
- 0846US2006222871A1Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloysBONHOTE CHRISTIAN R·Filed 2005·Application pending·0 cites
- 0940US2006221498A1Head design with low coefficient of thermal expansion insert layerHITACHI GLOBAL STORAGE TECH·Filed 2005·Application pending·0 cites
- 1027US2016309596A1Methods for forming cobalt interconnectsAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →