Inventor · disambiguated record
Jong-Myeong Lee
Also filed as: LEE JONG-MYEONG
60 granted patents·24 pending applications·583 citations·filing 2000–2024
98Inventor score
Top patents by PatentIndex Score
84 records- 0197US6391769B1Method for forming metal interconnection in semiconductor device and interconnection structure fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 21, 2002·177 cites·21 claims
- 0292US7081409B2Methods of producing integrated circuit devices utilizing tantalum amine derivativesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·50 cites·19 claims
- 0390US7842600B2Methods of forming interlayer dielectrics having air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 30, 2010·19 cites·16 claims
- 0490US6432820B1Method of selectively depositing a metal layer in an opening in a dielectric layer by forming a metal-deposition-prevention layer around the opening of the dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 13, 2002·43 cites·33 claims
- 0588US9627469B2Oxide film, integrated circuit device, and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 18, 2017·7 cites·9 claims
- 0687US8547747B2Non-volatile memory deviceKIM SU-KYOUNG·Filed 2011·Granted Oct 1, 2013·12 cites·19 claims
- 0787US7833855B2Methods of producing integrated circuit devices utilizing tantalum amine derivativesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 16, 2010·10 cites·33 claims
- 0887US7452811B2Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·10 cites·10 claims
- 0985US8696921B2Method of manufacturing a semiconductor devicePARK JIN-HO·Filed 2010·Granted Apr 15, 2014·8 cites·11 claims
- 1085US6787468B2Method of fabricating metal lines in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 7, 2004·40 cites·3 claims
- 1183US8304343B2Method of manufacturing a metal wiring structureCHOI KYUNG-IN·Filed 2011·Granted Nov 6, 2012·6 cites·22 claims
- 1283US8278207B2Methods of manufacturing semiconductor devicesPARK JIN-HO·Filed 2010·Granted Oct 2, 2012·6 cites·8 claims
- 1383US7521357B2Methods of forming metal wiring in semiconductor devices using etch stop layersSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·7 cites·24 claims
- 1482US9520460B2MIM capacitors with diffusion-blocking electrode structures and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 13, 2016·6 cites·9 claims
- 1580US8124524B2Methods of forming metal interconnection structuresCHOI KYUNG-IN·Filed 2010·Granted Feb 28, 2012·5 cites·9 claims
- 1679US8476763B2Semiconductor device conductive pattern structures including dummy conductive patternsKIM HEI-SEUNG·Filed 2011·Granted Jul 2, 2013·5 cites·8 claims
- 1779US8422845B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameKANG PIL-KYU·Filed 2010·Granted Apr 16, 2013·4 cites·8 claims
- 1879US6586340B2Wafer processing apparatus and wafer processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 1, 2003·19 cites·19 claims
- 1976US9355851B2Semiconductor devices and methods of manufacturing the sameHONG JONG-WON·Filed 2012·Granted May 31, 2016·3 cites·12 claims
- 2075US9543196B2Methods of fabricating semiconductor devices using nanowiresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·15 claims
- 2175US8581334B2Via structures and semiconductor devices having the via structuresLIM DONG-CHAN·Filed 2010·Granted Nov 12, 2013·5 cites·13 claims
- 2275US6849555B2Wafer processing apparatus and wafer processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·15 cites·39 claims
- 2375US6602782B2Methods for forming metal wiring layers and metal interconnects and metal interconnects formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 5, 2003·18 cites·36 claims
- 2474US8889543B2Method of fabricating semiconductor deviceBAEK JONG-MIN·Filed 2013·Granted Nov 18, 2014·4 cites·20 claims
- 2574US7816255B2Methods of forming a semiconductor device including a diffusion barrier filmSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 19, 2010·6 cites·7 claims
- 2671US8969196B2Semiconductor devices and methods of manufacturing the samePARK JIN-HO·Filed 2012·Granted Mar 3, 2015·2 cites·16 claims
- 2770US6964922B2Methods for forming metal interconnections for semiconductor devices having multiple metal depositionsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 15, 2005·13 cites·26 claims
- 2869US8053374B2Method of manufacturing a metal wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·3 cites·11 claims
- 2966US7189641B2Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layersSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 13, 2007·8 cites·17 claims
- 3064US12420240B2Composite membrane comprising highly permeable gutter layer and method for preparing sameKOREA RES INST CHEMICAL TECH·Filed 2021·Granted Sep 23, 2025·0 cites·8 claims
- 3164US8932964B2Method of forming a dielectric layer having an ONO structure using an in-situ processLEE WOO-JIN·Filed 2012·Granted Jan 13, 2015·1 cites·16 claims
- 3264US8867882B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·15 claims
- 3364US6673718B1Methods for forming aluminum metal wiringsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 6, 2004·12 cites·46 claims
- 3463US7807571B2Semiconductor device and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 5, 2010·2 cites·31 claims
- 3562US9875925B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 23, 2018·1 cites·17 claims
- 3662US8211793B2Structures electrically connecting aluminum and copper interconnections and methods of forming the sameLEE JONG-MYEONG·Filed 2010·Granted Jul 3, 2012·2 cites·20 claims
- 3762US8021980B2Methods of manufacturing semiconductor devices including a copper-based conductive layerSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Sep 20, 2011·1 cites·15 claims
- 3862US7279416B2Methods of forming a conductive structure in an integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 9, 2007·7 cites·38 claims
- 3961US7105444B2Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 12, 2006·6 cites·53 claims
- 4060US2024384944A1Radiator support cover and radiator including the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 4159US8044490B2Semiconductor device including fuseSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 25, 2011·1 cites·17 claims
- 4258US6905960B2Method of forming a contact in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 14, 2005·9 cites·13 claims
- 4358US6844627B2Metal film semiconductor device and a method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 18, 2005·7 cites·25 claims
- 4457US8497207B2Methods of forming semiconductor devices including landing pads formed by electroless platingYUN JONG-HO·Filed 2010·Granted Jul 30, 2013·1 cites·11 claims
- 4557US7384866B2Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·1 cites·6 claims
- 4655US2025347551A1Method and system for comprehensively diagnosing defect in rotating machineKOREA HYDRO & NUCLEAR POWER CO·Filed 2021·Application pending·0 cites
- 4754US8569862B2Integrated circuit devices with crack-resistant fuse structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 29, 2013·0 cites·4 claims
- 4853US6955983B2Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 18, 2005·9 cites·73 claims
- 4953US6699790B2Semiconductor device fabrication method for filling high aspect ratio openings in insulators with aluminumSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 2, 2004·5 cites·7 claims
- 5052US9754826B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 5, 2017·0 cites·8 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →