Inventor · disambiguated record
Jongho Lee
Also filed as: LEE JONGHO
91 granted patents·41 pending applications·485 citations·filing 2001–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD75GWANGJU INST SCIENCE & TECH8LG ELECTRONICS INC7SEOUL NAT UNIV R&DB FOUNDATION7WISCONSIN ALUMNI RES FOUND4
Top patents by PatentIndex Score
132 records- 0198US10330323B2Cooking deviceLG ELECTRONICS INC·Filed 2016·Granted Jun 25, 2019·30 cites·20 claims
- 0298US6844604B2Dielectric layer for semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jan 18, 2005·220 cites·41 claims
- 0395US9640513B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 2, 2017·15 cites·14 claims
- 0495US9450125B2Stretchable substrate, stretchable photovoltaic apparatus, and stretchable deviceGWANGJU INST SCIENCE & TECH·Filed 2013·Granted Sep 20, 2016·13 cites·14 claims
- 0594US9021942B2CookerLEE JONGHO·Filed 2012·Granted May 5, 2015·24 cites·12 claims
- 0693US11222873B2Semiconductor packages including stacked substrates and penetration electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0792US12062639B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·2 cites·20 claims
- 0892US11862603B2Semiconductor packages with chips partially embedded in adhesiveSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·18 claims
- 0991US11935873B2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 19, 2024·1 cites·17 claims
- 1088US11114364B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 7, 2021·5 cites·20 claims
- 1188US8970046B2Semiconductor packages and methods of forming the sameKIM YOUNG LYONG·Filed 2012·Granted Mar 3, 2015·10 cites·20 claims
- 1286US11282792B2Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 1386US10872875B2Bonding head and method for bonding semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·7 cites·19 claims
- 1485US11569145B2Semiconductor package with thermal interface material for improving package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 1583US11552033B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·18 claims
- 1682US11312639B2Water purifier and filter for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·1 cites·18 claims
- 1782US8680685B2Semiconductor package and method for fabricating the sameLIM HWAN-SIK·Filed 2010·Granted Mar 25, 2014·9 cites·33 claims
- 1881US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 1980US9281235B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 8, 2016·3 cites·15 claims
- 2080US8792977B2Quantitative motor function evaluation systemKAKEI SHINJI·Filed 2008·Granted Jul 29, 2014·48 cites·39 claims
- 2180US8482077B2Semiconductor devices and methods for fabricating the sameLEE JONGHO·Filed 2011·Granted Jul 9, 2013·6 cites·25 claims
- 2280US8053881B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·10 cites·5 claims
- 2380US2025035761A1Systems, methods, and media for improving signal-to-noise ratio in single-photon dataWISCONSIN ALUMNI RES FOUND·Filed 2024·Application pending·0 cites
- 2479US11471802B2Filter assembly for water purifierSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·1 cites·19 claims
- 2579US11391468B2Cooking deviceLG ELECTRONICS INC·Filed 2018·Granted Jul 19, 2022·2 cites·16 claims
- 2679US8823172B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 2, 2014·4 cites·18 claims
- 2779US2025180215A1Cooking deviceLG ELECTRONICS INC·Filed 2025·Application pending·0 cites
- 2879US2025015026A1Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2978US12253265B2Cooking deviceLG ELECTRONICS INC·Filed 2021·Granted Mar 18, 2025·0 cites·23 claims
- 3078US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 3178US11927700B1Systems, methods, and media for improving signal-to-noise ratio in single-photon dataWISCONSIN ALUMNI RES FOUND·Filed 2023·Granted Mar 12, 2024·0 cites·20 claims
- 3278US10109631B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 3378US9495909B2Organic light emitting displayLG DISPLAY CO LTD·Filed 2014·Granted Nov 15, 2016·3 cites·13 claims
- 3478US9435248B2Engine having coolant control valveHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 6, 2016·5 cites·10 claims
- 3578US2024321666A1Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3678US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3777US12002726B2Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 3876US12132019B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 3976US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 4076US10008488B2Semiconductor module adapted to be inserted into connector of external deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·3 cites·19 claims
- 4176US8652332B2Liquid filtration using pressure difference across a hydrophobic membraneKARNIK ROHIT N·Filed 2010·Granted Feb 18, 2014·4 cites·12 claims
- 4276US2024429205A1Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4375US10090328B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·2 cites·18 claims
- 4475US7112539B2Dielectric layer for semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 26, 2006·16 cites·22 claims
- 4574US11967581B2Package structures having underfillsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 4674US11694978B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 4772US8815731B2Semiconductor package and method of fabricating the sameKIM YOUNG LYONG·Filed 2011·Granted Aug 26, 2014·5 cites·18 claims
- 4871US11621250B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 4, 2023·0 cites·20 claims
- 4970US11610828B2Semiconductor package and method of manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·15 claims
- 5070US9851425B2Background-suppressed myelin water imagingUNIV PENNSYLVANIA·Filed 2013·Granted Dec 26, 2017·3 cites·12 claims
Showing the top 50 of 132 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jongho Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →