Inventor · disambiguated record
Josef Maerz
Also filed as: MAERZ JOSEF
11 granted patents·1 pending application·1 citations·filing 2004–2023
79Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG12
Top patents by PatentIndex Score
12 records- 0168US11903132B2Power electronic assembly having a laminate inlay and method of producing the power electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 0268US10886199B1Molded semiconductor package with double-sided coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0362US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0455US11632860B2Power electronic assembly and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 18, 2023·0 cites·20 claims
- 0555US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 0654US12094807B2Stacked transistor chip package with source couplingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 0752US11302613B2Double-sided cooled molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 0852US10964628B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 30, 2021·0 cites·12 claims
- 0947US7498194B2Semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 3, 2009·0 cites·15 claims
- 1042US11393743B2Semiconductor assembly with conductive frame for I/O standoff and thermal dissipationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 1138US7233059B2Semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 19, 2007·0 cites·8 claims
- 1236US10770399B2Semiconductor package having a filled conductive cavityINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 8, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →