Inventor · disambiguated record
John J. Maloney
Also filed as: MALONEY JOHN · MALONEY JOHN J · MALONEY JOHN JAY
24 granted patents·7 pending applications·257 citations·filing 1991–2021
95Inventor score
Top patents by PatentIndex Score
31 records- 0195US7405106B2Quad flat no-lead chip carrier with stand-offIBM·Filed 2006·Granted Jul 29, 2008·33 cites·10 claims
- 0291US7716992B2Sensor, method, and design structure for a low-k delamination sensorIBM·Filed 2008·Granted May 18, 2010·16 cites·19 claims
- 0391US7498673B2Heatplates for heatsink attachment for semiconductor chipsIBM·Filed 2006·Granted Mar 3, 2009·21 cites·14 claims
- 0490US11174170B2Modified black spinel pigments for glass and ceramic enamel applicationsFERRO CORP·Filed 2017·Granted Nov 16, 2021·4 cites·18 claims
- 0588US9871176B2Glass compositions and glass frit composites for use in optical applicationsFERRO CORP·Filed 2016·Granted Jan 16, 2018·7 cites·18 claims
- 0687US10562809B2Low K dielectric compositions for high frequency applicationsFERRO CORP·Filed 2018·Granted Feb 18, 2020·4 cites·17 claims
- 0787US9205505B2Hermetically sealed electronic device using solder bondingSRIDHARAN SRINIVASAN·Filed 2011·Granted Dec 8, 2015·8 cites·19 claims
- 0883US9499428B2Formation of glass-based seals using focused infrared radiationMALONEY JOHN J·Filed 2013·Granted Nov 22, 2016·7 cites·18 claims
- 0982US6346493B1Decorative glass enamelsFERRO CORP·Filed 1999·Granted Feb 12, 2002·66 cites·4 claims
- 1081US9545682B2Hermetically sealed electronic device using solder bondingFERRO CORP·Filed 2015·Granted Jan 17, 2017·3 cites·20 claims
- 1180US9272497B2Hermetically sealed electronic device using coated glass flakesKHADILKAR CHANDRASHEKHAR S·Filed 2011·Granted Mar 1, 2016·5 cites·15 claims
- 1279US9540274B2Low-melting lead-free bismuth sealing glassesSRIDHARAN SRINIVASAN·Filed 2011·Granted Jan 10, 2017·4 cites·24 claims
- 1378US7834444B2Heatplates for heatsink attachment for semiconductor chipsIBM·Filed 2009·Granted Nov 16, 2010·7 cites·20 claims
- 1471US5228910AMixed metal oxide crystalline powders and method for the synthesis thereofFERRO CORP·Filed 1991·Granted Jul 20, 1993·25 cites·10 claims
- 1570US9892853B2Mid-K LTCC compositions and devicesFERRO CORP·Filed 2015·Granted Feb 13, 2018·1 cites·20 claims
- 1669US6894382B1Optimized electronic packageIBM·Filed 2004·Granted May 17, 2005·16 cites·25 claims
- 1766US9969648B2Induction sealing of inorganic substratesSRIDHARAN SRINIVASAN·Filed 2012·Granted May 15, 2018·1 cites·16 claims
- 1864US5725919ALead-free glass enamels for decorating glass beverage containers and methods for using the sameFERRO CORP·Filed 1995·Granted Mar 10, 1998·28 cites·19 claims
- 1962US9156735B2Hermetic sealing of glass platesMALONEY JOHN J·Filed 2011·Granted Oct 13, 2015·1 cites·17 claims
- 2059US12195391B2Colored glass frits and related methods for laser marking applicationsFERRO CORP·Filed 2020·Granted Jan 14, 2025·0 cites·7 claims
- 2155US11225433B2Sintering aid for glasses for machinable phyllosilicate based structuresFERRO CORP·Filed 2016·Granted Jan 18, 2022·0 cites·19 claims
- 2254US2022119315A1M7 LTCC-Silver System And Related Dielectric Compositions For High Frequency ApplicationsFERRO CORP·Filed 2021·Application pending·0 cites
- 2352US8134225B2Quad flat no-lead chip carrier with standoffMALONEY JOHN J·Filed 2008·Granted Mar 13, 2012·0 cites·7 claims
- 2452US2008203546A1Quad flat no-lead chip carrier with stand-offIBM·Filed 2008·Application pending·0 cites
- 2551US2022234943A1Dark-Colored, Low-Expansion FillersFERRO CORP·Filed 2020·Application pending·0 cites
- 2644US10370290B2Passivation glasses for semiconductor devicesFERRO CORP·Filed 2017·Granted Aug 6, 2019·0 cites·20 claims
- 2744US2014261975A1Microwave Sealing Of Inorganic Substrates Using Low Melting Glass SystemsFERRO CORP·Filed 2012·Application pending·0 cites
- 2843US10577279B2Grain boundary healing glasses and their use in transparent enamels, transparent colored enamels and opaque enamelsFERRO CORP·Filed 2016·Granted Mar 3, 2020·0 cites·10 claims
- 2941US2022225501A1Conductive thick film paste for silicon nitride and other substratesFERRO CORP·Filed 2019·Application pending·0 cites
- 3035US2004159931A1Electronic package, heater block and methodIBM·Filed 2004·Application pending·0 cites
- 3133US2003183911A1Electronic package and methodIBM·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →