Inventor · disambiguated record
Joseph Daniel Mis
Also filed as: MIS JOSEPH DANIEL
6 granted patents·724 citations·filing 1996–1999
89Inventor score
Top patents by PatentIndex Score
6 records- 0196US5767010ASolder bump fabrication methods and structure including a titanium barrier layerMCNC·Filed 1996·Granted Jun 16, 1998·322 cites·35 claims
- 0295US5892179ASolder bumps and structures for integrated redistribution routing conductorsMCNC·Filed 1997·Granted Apr 6, 1999·91 cites·20 claims
- 0392US6329608B1Key-shaped solder bumps and under bump metallurgyUNITIVE INT LTD·Filed 1999·Granted Dec 11, 2001·65 cites·13 claims
- 0490US6389691B1Methods for forming integrated redistribution routing conductors and solder bumpsUNITIVE INT LTD·Filed 1999·Granted May 21, 2002·59 cites·29 claims
- 0589US6222279B1Solder bump fabrication methods and structures including a titanium barrier layerMCNC·Filed 1998·Granted Apr 24, 2001·103 cites·7 claims
- 0685US5902686AMethods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structuresMCNC·Filed 1996·Granted May 11, 1999·84 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →