Inventor · disambiguated record
Joon Seok Oh
Also filed as: OH JOON SEOK
21 granted patents·9 pending applications·75 citations·filing 2007–2024
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9LSIS CO LTD6HYNIX SEMICONDUCTOR INC4OH JOON SEOK4SAMSUNG ELECTRO MECH2
Top patents by PatentIndex Score
30 records- 0197US10026681B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·63 cites·36 claims
- 0292US11710715B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·2 cites·20 claims
- 0373US2025096181A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0469US12199060B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·18 claims
- 0569US7625695B2Polymers for anti-reflective coatings, anti-reflective coating compositions and methods of forming a pattern using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·2 cites·14 claims
- 0666US8278218B2Electrical conductor line having a multilayer diffusion barrier for use in a semiconductor device and method for forming the sameOH JOON SEOK·Filed 2011·Granted Oct 2, 2012·2 cites·14 claims
- 0765US10237018B2Communication device and communication methodLSIS CO LTD·Filed 2012·Granted Mar 19, 2019·2 cites·2 claims
- 0863US7875978B2Metal line having a multi-layered diffusion layer in a semiconductor device and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Jan 25, 2011·2 cites·19 claims
- 0963US7777336B2Metal line of semiconductor device and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Aug 17, 2010·2 cites·23 claims
- 1060US11682648B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·16 claims
- 1160US2025259912A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1256US7989582B2Process for producing poly-tetrahydrofuranHYOSUNG CORP·Filed 2008·Granted Aug 2, 2011·0 cites·3 claims
- 1352US2024321722A1Semiconductor package, and redistribution substrate for semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1451US2023301180A1Organic material for organic electric element, method for producing organic material for organic electric element, and organic electric element using sameDUK SAN NEOLUX CO LTD·Filed 2021·Application pending·0 cites
- 1550US8008708B2Metal line of semiconductor device having a diffusion barrier and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Aug 30, 2011·0 cites·20 claims
- 1649US10559540B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 1749US2010019386A1Electrical conductor line having a multilayer diffusion barrier for use in a semiconductor device and method for forming the sameOH JOON SEOK·Filed 2009·Application pending·0 cites
- 1848US7501224B2Compositions for use in forming a pattern and methods of forming a patternSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 10, 2009·0 cites·17 claims
- 1947US7981781B2Metal line of semiconductor device having a diffusion barrier and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Jul 19, 2011·0 cites·16 claims
- 2045US8080472B2Metal line having a MoxSiy/Mo diffusion barrier of semiconductor device and method for forming the sameOH JOON SEOK·Filed 2009·Granted Dec 20, 2011·0 cites·15 claims
- 2144US10724115B2Magnetite-based sintered ore and method of producing sameUNIV KOREA RES & BUS FOUND·Filed 2017·Granted Jul 28, 2020·0 cites·4 claims
- 2244US9306767B2Expandable Ethernet ring topology network and communication method thereofLSIS CO LTD·Filed 2013·Granted Apr 5, 2016·0 cites·6 claims
- 2343US8298744B2Coating material for photoresist pattern and method of forming fine pattern using the sameOH JOON-SEOK·Filed 2008·Granted Oct 30, 2012·0 cites·3 claims
- 2441US2010109697A1Probe card, needles of probe card, and method of manufacturing the needles of probe cardIM CO LTD·Filed 2007·Application pending·0 cites
- 2540US10142058B2Communication device and communication methodLSIS CO LTD·Filed 2012·Granted Nov 27, 2018·0 cites·9 claims
- 2640US10044469B2Communication device and communication methodLSIS CO LTD·Filed 2012·Granted Aug 7, 2018·0 cites·2 claims
- 2740US2015113078A1Communication device and communication methodLSIS CO LTD·Filed 2012·Application pending·0 cites
- 2836US2019027419A1Fan-out semiconductor package and package substrate comprising the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 2935US9360862B2PLC network extension systemYOON GEON·Filed 2012·Granted Jun 7, 2016·0 cites·7 claims
- 3029US2015324140A1Electronic device with memory data backup functionLSIS CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Joon Seok Oh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →