Inventor · disambiguated record
John W. Osenbach
Also filed as: OSENBACH JOHN · OSENBACH JOHN W · OSENBACH JOHN WILLIAM
83 granted patents·35 pending applications·1,145 citations·filing 1991–2025
99Inventor score
Top patents by PatentIndex Score
118 records- 0196US10026723B2Photonic integrated circuit packageINFINERA CORP·Filed 2017·Granted Jul 17, 2018·29 cites·30 claims
- 0296US8492911B2Stacked interconnect heat sinkBACHMAN MARK A·Filed 2010·Granted Jul 23, 2013·34 cites·7 claims
- 0395US8987137B2Method of fabrication of through-substrate viasBACHMAN MARK A·Filed 2010·Granted Mar 24, 2015·25 cites·18 claims
- 0495US5851849AProcess for passivating semiconductor laser structures with severe steps in surface topographyLUCENT TECHNOLOGIES INC·Filed 1997·Granted Dec 22, 1998·225 cites·17 claims
- 0592US9324557B2Method for fabricating equal height metal pillars of different diametersLSI CORP·Filed 2014·Granted Apr 26, 2016·14 cites·22 claims
- 0691US8766436B2Moisture barrier for a wire bondDELUCCA JOHN M·Filed 2011·Granted Jul 1, 2014·37 cites·17 claims
- 0791US8742535B2Integration of shallow trench isolation and through-substrate vias into integrated circuit designsBACHMAN MARK A·Filed 2010·Granted Jun 3, 2014·13 cites·9 claims
- 0890US8378485B2Solder interconnect by addition of copperLSI CORP·Filed 2009·Granted Feb 19, 2013·16 cites·23 claims
- 0990US7224047B2Semiconductor device package with reduced leakageLSI CORP·Filed 2004·Granted May 29, 2007·62 cites·20 claims
- 1088US10037982B2Photonic integrated circuit packageINFINERA CORP·Filed 2017·Granted Jul 31, 2018·5 cites·35 claims
- 1186US10122149B2Tunable waveguide devicesINFINERA CORP·Filed 2017·Granted Nov 6, 2018·2 cites·10 claims
- 1285US8183698B2Bond pad support structure for semiconductor deviceANTOL JOZE E·Filed 2007·Granted May 22, 2012·19 cites·20 claims
- 1382US10741999B2Tunable waveguide devicesINFINERA CORP·Filed 2018·Granted Aug 11, 2020·1 cites·42 claims
- 1482US10290619B2Photonic integrated circuit packageINFINERA CORP·Filed 2017·Granted May 14, 2019·3 cites·15 claims
- 1581US8013428B2Whisker-free lead framesLSI CORP·Filed 2009·Granted Sep 6, 2011·13 cites·16 claims
- 1681US5990560AMethod and compositions for achieving a kinetically controlled solder bondLUCENT TECHNOLOGIES INC·Filed 1997·Granted Nov 23, 1999·46 cites·20 claims
- 1779US7423341B2Plastic overmolded packages with mechanically decoupled lid attach attachmentAGERE SYSTEMS INC·Filed 2006·Granted Sep 9, 2008·10 cites·11 claims
- 1878US7982307B2Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrateAGERE SYSTEMS INC·Filed 2006·Granted Jul 19, 2011·9 cites·20 claims
- 1977US8502372B2Low-cost 3D face-to-face out assemblyOSENBACH JOHN·Filed 2011·Granted Aug 6, 2013·6 cites·20 claims
- 2075US9613847B2Integration of shallow trench isolation and through-substrate vias into integrated circuit designsLSI CORP·Filed 2014·Granted Apr 4, 2017·3 cites·15 claims
- 2175US7277173B1Active optical alignment using MEMS mirrorsLUCENT TECHNOLOGIES INC·Filed 2003·Granted Oct 2, 2007·19 cites·6 claims
- 2275US6265757B1Forming attached features on a semiconductor substrateAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jul 24, 2001·47 cites·13 claims
- 2375US5418190AMethod of fabrication for electro-optical devicesAT & T CORP·Filed 1993·Granted May 23, 1995·62 cites·8 claims
- 2473US9784933B2Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry deviceINFINERA CORP·Filed 2015·Granted Oct 10, 2017·2 cites·31 claims
- 2572US8653375B2Mitigation of whiskers in Sn-filmsOSENBACH JOHN W·Filed 2008·Granted Feb 18, 2014·5 cites·27 claims
- 2672US8580621B2Solder interconnect by addition of copperLSI CORP·Filed 2013·Granted Nov 12, 2013·2 cites·10 claims
- 2772US7541669B2Semiconductor device package with base features to reduce leakageAGERE SYSTEMS INC·Filed 2007·Granted Jun 2, 2009·5 cites·16 claims
- 2872US7009299B2Kinetically controlled solderAGERE SYSTEMS INC·Filed 2001·Granted Mar 7, 2006·18 cites·10 claims
- 2971US7888257B2Integrated circuit package including wire bondsAGERE SYSTEMS INC·Filed 2007·Granted Feb 15, 2011·6 cites·15 claims
- 3070US8242378B2Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder massAMIN AHMED·Filed 2007·Granted Aug 14, 2012·7 cites·12 claims
- 3170US8133799B2Controlling warping in integrated circuit devicesOSENBACH JOHN W·Filed 2011·Granted Mar 13, 2012·2 cites·12 claims
- 3269US6862378B2Silicon-based high speed optical wiring boardTRIQUINT TECHNOLOGY HOLDING CO·Filed 2002·Granted Mar 1, 2005·14 cites·18 claims
- 3367US10962296B2Low-cost nano-heat pipeINFINERA CORP·Filed 2019·Granted Mar 30, 2021·1 cites·7 claims
- 3467US10205301B2Tunable waveguide devicesINFINERA CORP·Filed 2018·Granted Feb 12, 2019·0 cites·30 claims
- 3567US10181697B2Tunable waveguide devicesINFINERA CORP·Filed 2018·Granted Jan 15, 2019·0 cites·42 claims
- 3667US10181698B2Tunable waveguide devicesINFINERA CORP·Filed 2018·Granted Jan 15, 2019·0 cites·24 claims
- 3767US8779587B2PB-free solder bumps with improved mechanical propertiesBACHMAN MARK·Filed 2008·Granted Jul 15, 2014·3 cites·6 claims
- 3867US6960836B2Reinforced bond padAGERE SYSTEMS INC·Filed 2003·Granted Nov 1, 2005·13 cites·6 claims
- 3967US6265240B1Method and apparatus for passively aligning components on semiconductor diesLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jul 24, 2001·36 cites·16 claims
- 4067US6117794AMethod for improved metal oxide bonding of optical elementsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Sep 12, 2000·34 cites·7 claims
- 4166US10177531B2Tunable waveguide devicesINFINERA CORP·Filed 2018·Granted Jan 8, 2019·0 cites·24 claims
- 4265US7724359B2Method of making electronic entitiesAGERE SYSTEMS INC·Filed 2008·Granted May 25, 2010·2 cites·14 claims
- 4361US7598602B2Controlling warping in integrated circuit devicesAGERE SYSTEMS INC·Filed 2008·Granted Oct 6, 2009·1 cites·2 claims
- 4461US7408246B2Controlling warping in integrated circuit devicesAGERE SYSTEMS INC·Filed 2005·Granted Aug 5, 2008·1 cites·16 claims
- 4560US7671436B2Electronic packagesAGERE SYSTEMS INC·Filed 2008·Granted Mar 2, 2010·2 cites·21 claims
- 4660US6894400B1Robust electronic device packagesAGERE SYSTEMS INC·Filed 2004·Granted May 17, 2005·9 cites·20 claims
- 4760US6517258B1Plastic packaged optoelectronic deviceAGERE SYSTEMS INC·Filed 1999·Granted Feb 11, 2003·24 cites·20 claims
- 4860US2025244548A1Semi-sintered thermomechanical joints in an optical transceiver sub-assemblyINFINERA CORP·Filed 2025·Application pending·0 cites
- 4960US2025067945A1Non-hermetic package having internal temperature controlINFINERA CORP·Filed 2024·Application pending·0 cites
- 5059US7727781B2Manufacture of devices including solder bumpsAGERE SYSTEMS INC·Filed 2008·Granted Jun 1, 2010·1 cites·3 claims
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →