Inventor · disambiguated record
John M. Pedersen
Also filed as: PEDERSEN JOHN M
18 granted patents·1 pending application·590 citations·filing 1995–2005
96Inventor score
Files withSEMITOOL INC18
Top patents by PatentIndex Score
19 records- 0194US6309520B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 30, 2001·92 cites·61 claims
- 0293US6309524B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 30, 2001·107 cites·39 claims
- 0391US5660517ASemiconductor processing system with wafer container docking and loading stationSEMITOOL INC·Filed 1995·Granted Aug 26, 1997·84 cites·10 claims
- 0489US6699373B2Apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 2001·Granted Mar 2, 2004·40 cites·42 claims
- 0587US6869510B2Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 2001·Granted Mar 22, 2005·26 cites·21 claims
- 0687US6303010B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Oct 16, 2001·81 cites·8 claims
- 0786US6773560B2Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2001·Granted Aug 10, 2004·39 cites·70 claims
- 0884US6527925B1Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2000·Granted Mar 4, 2003·23 cites·32 claims
- 0983US7645366B2Microelectronic workpiece holders and contact assemblies for use therewithSEMITOOL INC·Filed 2005·Granted Jan 12, 2010·6 cites·22 claims
- 1081US6911127B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Jun 28, 2005·17 cites·42 claims
- 1179US6673216B2Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processingSEMITOOL INC·Filed 2001·Granted Jan 6, 2004·18 cites·7 claims
- 1275US6645356B1Methods and apparatus for processing the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Nov 11, 2003·28 cites·56 claims
- 1365US6471460B1Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assemblySEMITOOL INC·Filed 2000·Granted Oct 29, 2002·10 cites·22 claims
- 1462US6962649B2Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpiecesSEMITOOL INC·Filed 2001·Granted Nov 8, 2005·8 cites·44 claims
- 1560US6939448B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Sep 6, 2005·6 cites·29 claims
- 1658US7048841B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted May 23, 2006·5 cites·5 claims
- 1751US2005189213A1Method and apparatus for copper plating using electroless plating and electroplatingFiled 2005·Application pending·0 cites
- 1844US7288179B2Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processingSEMITOOL INC·Filed 2003·Granted Oct 30, 2007·0 cites·35 claims
- 1944US7288172B2Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processingSEMITOOL INC·Filed 2003·Granted Oct 30, 2007·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →