Inventor · disambiguated record
Joshua M. Rubin
Also filed as: RUBIN JOSHUA · RUBIN JOSHUA M · RUBIN JOSHUA MARK
88 granted patents·26 pending applications·625 citations·filing 2009–2024
99Inventor score
Top patents by PatentIndex Score
114 records- 0199US10103065B1Gate metal patterning for tight pitch applicationsIBM·Filed 2017·Granted Oct 16, 2018·50 cites·12 claims
- 0299US9954058B1Self-aligned air gap spacer for nanosheet CMOS devicesIBM·Filed 2017·Granted Apr 24, 2018·79 cites·11 claims
- 0398US11164817B2Multi-chip package structures with discrete redistribution layersIBM·Filed 2019·Granted Nov 2, 2021·32 cites·20 claims
- 0498US10607938B1Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2018·Granted Mar 31, 2020·50 cites·10 claims
- 0598US10535608B1Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrateIBM·Filed 2018·Granted Jan 14, 2020·86 cites·19 claims
- 0698US9711501B1Interlayer viaIBM·Filed 2016·Granted Jul 18, 2017·34 cites·10 claims
- 0797US11094637B2Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layersIBM·Filed 2019·Granted Aug 17, 2021·17 cites·20 claims
- 0897US10243043B2Self-aligned air gap spacer for nanosheet CMOS devicesIBM·Filed 2017·Granted Mar 26, 2019·16 cites·9 claims
- 0996US10804204B2Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrateIBM·Filed 2019·Granted Oct 13, 2020·19 cites·19 claims
- 1096US10692768B1Vertical transport field-effect transistor architectureIBM·Filed 2019·Granted Jun 23, 2020·13 cites·20 claims
- 1195US10461148B1Multilayer buried metal-insultor-metal capacitor structuresIBM·Filed 2018·Granted Oct 29, 2019·10 cites·20 claims
- 1294US11101318B2Back-side memory element with local memory select transistorIBM·Filed 2019·Granted Aug 24, 2021·14 cites·4 claims
- 1394US10748901B2Interlayer via contacts for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2018·Granted Aug 18, 2020·11 cites·15 claims
- 1494US10573521B2Gate metal patterning to avoid gate stack attack due to excessive wet etchingIBM·Filed 2018·Granted Feb 25, 2020·8 cites·18 claims
- 1594US10446606B2Back-side memory element with local memory select transistorIBM·Filed 2017·Granted Oct 15, 2019·13 cites·6 claims
- 1694US10283411B1Stacked vertical transistor device for three-dimensional monolithic integrationIBM·Filed 2018·Granted May 7, 2019·12 cites·20 claims
- 1794US10217674B1Three-dimensional monolithic vertical field effect transistor logic gatesIBM·Filed 2017·Granted Feb 26, 2019·16 cites·9 claims
- 1894US9786546B1Bulk to silicon on insulator deviceIBM·Filed 2016·Granted Oct 10, 2017·7 cites·18 claims
- 1993US11574875B2Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layersIBM·Filed 2021·Granted Feb 7, 2023·2 cites·20 claims
- 2093US10593681B1Three-dimensional monolithic vertical transistor memory cell with unified inter-tier cross-coupleIBM·Filed 2018·Granted Mar 17, 2020·9 cites·18 claims
- 2193US9735062B1Defect reduction in channel silicon germanium on patterned siliconIBM·Filed 2016·Granted Aug 15, 2017·9 cites·20 claims
- 2293US9634113B2Fully silicided linerless middle-of-line (MOL) contactIBM·Filed 2015·Granted Apr 25, 2017·7 cites·6 claims
- 2392US10483344B1Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layersIBM·Filed 2018·Granted Nov 19, 2019·8 cites·18 claims
- 2491US10636791B1Vertical field-effect transistors for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2018·Granted Apr 28, 2020·5 cites·17 claims
- 2591US9761498B2Selective oxidation of buried silicon-germanium to form tensile strained silicon FinFETsIBM·Filed 2016·Granted Sep 12, 2017·6 cites·6 claims
- 2691US9570590B1Selective oxidation of buried silicon-germanium to form tensile strained silicon FinFETsIBM·Filed 2015·Granted Feb 14, 2017·6 cites·14 claims
- 2790US10714420B1High cutoff frequency metal-insulator-metal capacitors implemented using via contact configurationsIBM·Filed 2019·Granted Jul 14, 2020·7 cites·20 claims
- 2889US11069679B2Reducing gate resistance in stacked vertical transport field effect transistorsIBM·Filed 2019·Granted Jul 20, 2021·4 cites·8 claims
- 2989US10770460B2Vertical field-effect transistors for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2020·Granted Sep 8, 2020·2 cites·20 claims
- 3089US10755985B2Gate metal patterning for tight pitch applicationsIBM·Filed 2018·Granted Aug 25, 2020·4 cites·8 claims
- 3189US10600694B2Gate metal patterning for tight pitch applicationsIBM·Filed 2018·Granted Mar 24, 2020·4 cites·6 claims
- 3289US10325821B1Three-dimensional stacked vertical transport field effect transistor logic gate with buried power busIBM·Filed 2017·Granted Jun 18, 2019·6 cites·8 claims
- 3387US10700067B2Vertical field-effect transistors for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2019·Granted Jun 30, 2020·3 cites·20 claims
- 3487US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 3585US11133259B2Multi-chip package structure having high density chip interconnect bridge with embedded power distribution networkIBM·Filed 2019·Granted Sep 28, 2021·4 cites·20 claims
- 3684US11563003B2Fin top hard mask formation after wafer flipping processIBM·Filed 2021·Granted Jan 24, 2023·1 cites·24 claims
- 3784US9978871B2Bulk to silicon on insulator deviceIBM·Filed 2016·Granted May 22, 2018·2 cites·12 claims
- 3884US9853151B2Fully silicided linerless middle-of-line (MOL) contactIBM·Filed 2015·Granted Dec 26, 2017·3 cites·7 claims
- 3984US9627410B2Metallized junction FinFET structuresIBM·Filed 2015·Granted Apr 18, 2017·3 cites·6 claims
- 4083US11276576B2Gate metal patterning to avoid gate stack attack due to excessive wet etchingIBM·Filed 2019·Granted Mar 15, 2022·2 cites·18 claims
- 4182US10910312B2Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2019·Granted Feb 2, 2021·2 cites·16 claims
- 4282US10903165B2Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devicesIBM·Filed 2019·Granted Jan 26, 2021·2 cites·20 claims
- 4382US10121877B1Vertical field effect transistor with metallic bottom regionIBM·Filed 2017·Granted Nov 6, 2018·3 cites·18 claims
- 4481US11164791B2Contact formation for stacked vertical transport field-effect transistorsIBM·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 4581US11049844B2Semiconductor wafer having trenches with varied dimensions for multi-chip modulesIBM·Filed 2019·Granted Jun 29, 2021·3 cites·4 claims
- 4681US9812571B2Tensile strained high percentage silicon germanium alloy FinFETsIBM·Filed 2015·Granted Nov 7, 2017·3 cites·13 claims
- 4779US10991635B2Multiple chip bridge connectorIBM·Filed 2019·Granted Apr 27, 2021·2 cites·20 claims
- 4879US10971504B2Three-dimensional monolithic vertical transistor memory cell with unified inter-tier cross-coupleIBM·Filed 2020·Granted Apr 6, 2021·1 cites·20 claims
- 4979US9349798B1CMOS structures with selective tensile strained NFET fins and relaxed PFET finsIBM·Filed 2015·Granted May 24, 2016·2 cites·3 claims
- 5078US10546915B2Buried MIM capacitor structure with landing padsIBM·Filed 2017·Granted Jan 28, 2020·2 cites·14 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →