Inventor · disambiguated record
John W. Smith
Also filed as: SMITH JOHN · SMITH JOHN S · SMITH JOHN W · SMITH JOHN WALLACE
160 granted patents·14 pending applications·12,415 citations·filing 1975–2024
99Inventor score
Top patents by PatentIndex Score
174 records- 0199US5802699AMethods of assembling microelectronic assembly with socket for engaging bump leadsTESSERA INC·Filed 1994·Granted Sep 8, 1998·434 cites·30 claims
- 0299US5659952AMethod of fabricating compliant interface for semiconductor chipTESSERA INC·Filed 1994·Granted Aug 26, 1997·491 cites·48 claims
- 0399US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 0499US5518964AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1994·Granted May 21, 1996·659 cites·49 claims
- 0599US5455390AMicroelectronics unit mounting with multiple lead bondingTESSERA INC·Filed 1994·Granted Oct 3, 1995·407 cites·23 claims
- 0698US6586955B2Methods and structures for electronic probing arraysTESSERA INC·Filed 2001·Granted Jul 1, 2003·137 cites·65 claims
- 0798US6202297B1Socket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1998·Granted Mar 20, 2001·208 cites·8 claims
- 0898US6194291B1Microelectronic assemblies with multiple leadsTESSERA INC·Filed 1999·Granted Feb 27, 2001·182 cites·14 claims
- 0998US5810609ASocket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1995·Granted Sep 22, 1998·167 cites·26 claims
- 1098US5801441AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1995·Granted Sep 1, 1998·245 cites·16 claims
- 1198US5632631AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1994·Granted May 27, 1997·280 cites·13 claims
- 1297US6828668B2Flexible lead structures and methods of making sameTESSERA INC·Filed 2002·Granted Dec 7, 2004·143 cites·66 claims
- 1397US6044548AMethods of making connections to a microelectronic unitTESSERA INC·Filed 1998·Granted Apr 4, 2000·119 cites·6 claims
- 1497US5989936AMicroelectronic assembly fabrication with terminal formation from a conductive layerTESSERA INC·Filed 1997·Granted Nov 23, 1999·215 cites·28 claims
- 1597US5980270ASoldering with resilient contactsTESSERA INC·Filed 1996·Granted Nov 9, 1999·249 cites·34 claims
- 1697US5688716AFan-out semiconductor chip assemblyTESSERA INC·Filed 1996·Granted Nov 18, 1997·225 cites·17 claims
- 1797US5615824ASoldering with resilient contactsTESSERA INC·Filed 1995·Granted Apr 1, 1997·217 cites·15 claims
- 1896US6437240B2Microelectronic connections with liquid conductive elementsTESSERA INC·Filed 2001·Granted Aug 20, 2002·84 cites·8 claims
- 1996US6365975B1Chip with internal signal routing in external elementTESSERA INC·Filed 1998·Granted Apr 2, 2002·240 cites·27 claims
- 2096US6359335B1Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structuresTESSERA INC·Filed 2000·Granted Mar 19, 2002·113 cites·10 claims
- 2196US6239384B1Microelectric lead structures with plural conductorsTESSERA INC·Filed 1998·Granted May 29, 2001·234 cites·35 claims
- 2296US6205660B1Method of making an electronic contactTESSERA INC·Filed 1997·Granted Mar 27, 2001·152 cites·15 claims
- 2396US6117694AFlexible lead structures and methods of making sameTESSERA INC·Filed 1999·Granted Sep 12, 2000·219 cites·56 claims
- 2496US5929517ACompliant integrated circuit package and method of fabricating the sameTESSERA INC·Filed 1994·Granted Jul 27, 1999·185 cites·16 claims
- 2596US5812378AMicroelectronic connector for engaging bump leadsTESSERA INC·Filed 1995·Granted Sep 22, 1998·239 cites·60 claims
- 2696US5808874AMicroelectronic connections with liquid conductive elementsTESSERA INC·Filed 1996·Granted Sep 15, 1998·147 cites·22 claims
- 2795US7166914B2Semiconductor package with heat sinkTESSERA INC·Filed 2004·Granted Jan 23, 2007·81 cites·7 claims
- 2895US6525429B1Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2000·Granted Feb 25, 2003·69 cites·20 claims
- 2995US6130116AMethod of encapsulating a microelectronic assembly utilizing a barrierTESSERA INC·Filed 1997·Granted Oct 10, 2000·148 cites·14 claims
- 3095US6012224AMethod of forming compliant microelectronic mounting deviceTESSERA INC·Filed 1997·Granted Jan 11, 2000·157 cites·19 claims
- 3195US6002168AMicroelectronic component with rigid interposerTESSERA INC·Filed 1997·Granted Dec 14, 1999·204 cites·48 claims
- 3295US5913109AFixtures and methods for lead bonding and deformationTESSERA INC·Filed 1996·Granted Jun 15, 1999·134 cites·19 claims
- 3394US9957210B2Process for the preparation of 2,3,3,3-tetrafluoropropeneMEXICHEM AMANCO HOLDING SA·Filed 2015·Granted May 1, 2018·4 cites·20 claims
- 3494US6848173B2Microelectric packages having deformed bonded leads and methods thereforTESSERA INC·Filed 2001·Granted Feb 1, 2005·82 cites·22 claims
- 3594US6821815B2Method of assembling a semiconductor chip packageTESSERA INC·Filed 2003·Granted Nov 23, 2004·66 cites·55 claims
- 3694US6274820B1Electrical connections with deformable contactsTESSERA INC·Filed 2000·Granted Aug 14, 2001·52 cites·41 claims
- 3794US5798286AConnecting multiple microelectronic elements with lead deformationTESSERA INC·Filed 1995·Granted Aug 25, 1998·134 cites·26 claims
- 3894US5776796AMethod of encapsulating a semiconductor packageTESSERA INC·Filed 1996·Granted Jul 7, 1998·173 cites·47 claims
- 3994US5706174ACompliant microelectrionic mounting deviceTESSERA INC·Filed 1997·Granted Jan 6, 1998·142 cites·13 claims
- 4093US6228686B1Method of fabricating a microelectronic assembly using sheets with gaps to define lead regionsTESSERA INC·Filed 1998·Granted May 8, 2001·123 cites·23 claims
- 4193US6080932ASemiconductor package assemblies with moisture ventsTESSERA INC·Filed 1998·Granted Jun 27, 2000·135 cites·25 claims
- 4293US6030856ABondable compliant pads for packaging of a semiconductor chip and method thereforTESSERA INC·Filed 1997·Granted Feb 29, 2000·127 cites·36 claims
- 4393US5934914AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1997·Granted Aug 10, 1999·117 cites·14 claims
- 4493US5663106AMethod of encapsulating die and chip carrierTESSERA INC·Filed 1994·Granted Sep 2, 1997·173 cites·47 claims
- 4593US4252761AProcess for making spontaneously dispersible modified cellulosic fiber sheetsBUCKEYE CELLULOSE CORP·Filed 1978·Granted Feb 24, 1981·72 cites·12 claims
- 4692US6965158B2Multi-layer substrates and fabrication processesTESSERA INC·Filed 2002·Granted Nov 15, 2005·48 cites·26 claims
- 4792US6870272B2Methods of making microelectronic assemblies including compliant interfacesTESSERA INC·Filed 2002·Granted Mar 22, 2005·55 cites·21 claims
- 4892US6635553B1Microelectronic assemblies with multiple leadsTESSERA INC·Filed 2000·Granted Oct 21, 2003·43 cites·19 claims
- 4992US6603209B1Compliant integrated circuit packageTESSERA INC·Filed 1999·Granted Aug 5, 2003·96 cites·25 claims
- 5092US6266874B1Methods of making microelectronic components having electrophoretically deposited layersTESSERA INC·Filed 1998·Granted Jul 31, 2001·62 cites·16 claims
Showing the top 50 of 174 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →