Inventor · disambiguated record
John Paul Tellkamp
Also filed as: TELLKAMP JOHN · TELLKAMP JOHN P · TELLKAMP JOHN PAUL
30 granted patents·9 pending applications·166 citations·filing 2000–2023
96Inventor score
Top patents by PatentIndex Score
39 records- 0194US8753924B2Grown carbon nanotube die attach structures, articles, devices, and processes for making themWAINERDI JAMES COOPER·Filed 2012·Granted Jun 17, 2014·13 cites·60 claims
- 0289US12009336B2Packages with electrical fusesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·3 cites·19 claims
- 0388US7413934B2Leadframes for improved moisture reliability and enhanced solderability of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 19, 2008·15 cites·7 claims
- 0487US7125789B2Composite metal column for mounting semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 24, 2006·35 cites·5 claims
- 0581US10439065B2Inverted leads for packaged isolation devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 8, 2019·3 cites·40 claims
- 0679US7821111B2Semiconductor device having grooved leads to confine solder wickingTEXAS INSTRUMENTS INC·Filed 2007·Granted Oct 26, 2010·7 cites·6 claims
- 0777US10892405B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 12, 2021·2 cites·21 claims
- 0877US8129227B2Semiconductor device having grooved leads to confine solder wickingTELLKAMP JOHN P·Filed 2010·Granted Mar 6, 2012·5 cites·16 claims
- 0976US12336231B2Inverted leads for packaged isolation devicesTEXAS INSTRUMENTS INC·Filed 2023·Granted Jun 17, 2025·0 cites·24 claims
- 1076US6518647B1Plated aluminum leadframes for semiconductor devices, including two nickel layers, and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 11, 2003·24 cites·13 claims
- 1174US7972905B2Packaged electronic device having metal comprising self-healing die attach materialTEXAS INSTRUMENTS INC·Filed 2009·Granted Jul 5, 2011·5 cites·11 claims
- 1273US6946856B1Thermal testing method for integrated circuit chips and packagesTEXAS INSTRUMENTS INC·Filed 2004·Granted Sep 20, 2005·19 cites·22 claims
- 1370US11557722B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1465US7012018B2Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 14, 2006·10 cites·8 claims
- 1563US7256481B2Leadframes for improved moisture reliability and enhanced solderability of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 14, 2007·2 cites·13 claims
- 1661US7095121B2Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 22, 2006·8 cites·24 claims
- 1759US11658243B2Inverted leads for packaged isolation devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted May 23, 2023·0 cites·24 claims
- 1858US12293953B2Edge bend for isolation packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted May 6, 2025·0 cites·20 claims
- 1958US7550852B2Composite metal column for mounting semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 23, 2009·1 cites·13 claims
- 2055US11574884B2Multi-function bond padTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 7, 2023·0 cites·47 claims
- 2155US11569153B2Leadframes with folded conductor portion and devices therefromTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 31, 2023·0 cites·26 claims
- 2255US6747343B2Aluminum leadframes with two nickel layersTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 8, 2004·5 cites·21 claims
- 2352US6933177B2Aluminum leadframes for semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 23, 2005·4 cites·4 claims
- 2450US9239353B2Testing of integrated circuits with external clearance requirementsTEXAS INSTRUMENTS INC·Filed 2013·Granted Jan 19, 2016·0 cites·20 claims
- 2549US8378506B2Packaged electronic device having metal comprising self-healing die attach materialTEXAS INSTRUMENTS INC·Filed 2011·Granted Feb 19, 2013·0 cites·12 claims
- 2649US7256117B2Method for evaluating and modifying solder attach design for integrated circuit packaging assemblyTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 14, 2007·0 cites·7 claims
- 2749US7044304B2Anti-corrosion overcoat cover tapeTEXAS INSTRUMENTS INC·Filed 2002·Granted May 16, 2006·3 cites·9 claims
- 2849US2013130411A1Interleaf for Leadframe IdentificationTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2949US2019109061A1Edge Bend for Isolation PackagesTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 3048US8377747B2Interleaf for leadframe identificationTEXAS INSTRUMENTS INC·Filed 2010·Granted Feb 19, 2013·0 cites·12 claims
- 3147US7166481B2Method for evaluating and modifying solder attach design for integrated circuit packaging assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Jan 23, 2007·2 cites·8 claims
- 3245US2021305024A1Plasma cleaning for packaging electronic devicesTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 3343US2014131086A1Lead Frame Strip with Half (1/2) Thickness Pull Out TabTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3442US2008067646A1Semiconductor leadframe for uniform mold compound flowTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3538US6692633B2Sacrificial anode for corrosion protection of semiconductor metallization during sawingTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 17, 2004·0 cites·17 claims
- 3638US2013056261A1Lead frame strip with improved package separabilityTELLKAMP JOHN PAUL·Filed 2011·Application pending·0 cites
- 3735US2002047186A1Semiconductor leadframes comprising silver platingFiled 2001·Application pending·0 cites
- 3835US2006156080A1Method for the thermal testing of a thermal path to an integrated circuitTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 3933US2012107552A1Chip Attachment Layer Having Traverse-Aligned Conductive Filler ParticlesTELLKAMP JOHN P·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →