Interleaf for Leadframe Identification

Abstract

A method of making an IC device includes providing a stack of leadframe sheets each including a plurality of leadframes and an interleaf member interposed between adjacent ones of the leadframe sheets. The interleaf members include indicia that identifies the leadframes sheets. The stack of leadframe sheets is loaded onto an assembly machine. A first interleaf member is removed from the first leadframe sheet. The first leadframe sheet is transferred onto a mounting surface of the assembly machine. Semiconductor die are attached to leadframes on the first leadframe sheet. The method can include reading the indicia from the first interleaf member to determine a part number and lead finish for the first leadframe sheet, verifying the part number for the first leadframe sheet by comparing to a build list, and transferring the first leadframe sheet onto a mounting surface of the assembly machine only if the part number is verified.

I claim: 
     
         1 - 12 . (canceled) 
     
     
         13 . A method of making an integrated circuit (IC) device, comprising:
 providing a stack of leadframe sheets each comprising a plurality of leadframes and a plurality of interleaf members including an interleaf member interposed between adjacent ones of said leadframe sheets, said plurality of interleaf members including indicia comprising at least one data identifier that identifies a part number associated with leadframes sheets;   loading said stack of leadframe sheets onto an assembly machine;   reading said data identifier from a first interleaf member to determine said part number for said first leadframe sheet;   removing said first interleaf member from said first leadframe sheet;   verifying said part number for said first leadframe sheet by comparing to a build list for assembling a semiconductor die;   transferring said first leadframe sheet onto a mounting surface of said assembly machine only if said part number is verified as being correct, and   attaching said semiconductor die to respective ones of said plurality of leadframes on said first leadframe sheet.   
     
     
         14 . The method of  claim 13 , wherein said data identifier also identifies a finish texture for said leadframe sheets, and wherein said reading said identifier comprises determining said part number and said finish texture, and said verifying comprises verify said part number and said finish texture. 
     
     
         15 . The method of  claim 13 , wherein said assembly machine comprises a pattern recognition system, and wherein before said reading said assembly machine picks up said first leadframe sheet and said first interleaf member, and said first interleaf member is then removed from first leadframe sheet by said assembly machine, wherein said reading is performed by said assembly machine. 
     
     
         16 . The method of  claim 13 , wherein said indicia comprises both a human readable format and a machine readable alpha numeric sequence or a machine readable bar code. 
     
     
         17 . The method of  claim 16 , wherein said human readable format comprises a numerical sequence. 
     
     
         18 . The method of  claim 13 , wherein said leadframe sheets are exclusive of any stamped or etched identifiers.