Inventor · disambiguated record
John Valliant
Also filed as: VALLIANT JOHN
3 granted patents·8 pending applications·33 citations·filing 2001–2025
66Inventor score
Top patents by PatentIndex Score
11 records- 0179US6672947B2Method for global die thinning and polishing of flip-chip packaged integrated circuitsNPTEST LLC·Filed 2001·Granted Jan 6, 2004·31 cites·15 claims
- 0277US2025305177A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF INC·Filed 2025·Application pending·0 cites
- 0369US11661668B2Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF INC·Filed 2021·Granted May 30, 2023·0 cites·13 claims
- 0468US2024011179A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF INC·Filed 2023·Application pending·0 cites
- 0563US2021027903A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF·Filed 2020·Application pending·0 cites
- 0650US2019221325A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF·Filed 2019·Application pending·0 cites
- 0747US2017271036A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF·Filed 2017·Application pending·0 cites
- 0846US2013301769A1Processes, systems, and apparatus for cyclotron production of technetium-99mTRIUMF·Filed 2013·Application pending·0 cites
- 0944US6939209B2Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuitsCREDENCE SYSTEMS CORP·Filed 2003·Granted Sep 6, 2005·2 cites·27 claims
- 1034US2004014401A1Method for backside die thinning and polishing of packaged integrated circuitsFiled 2003·Application pending·0 cites
- 1133US2012053318A1Method of radiolabelingSIMMS RYAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →