Inventor · disambiguated record
Jo Fei Wang
Also filed as: WANG JO-FEI
30 granted patents·164 citations·filing 1996–2015
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG8TSAI PO-FENG6TAIWAN SEMICONDUCTOR MFG CO LTD5WU SUNNY4HSU CHIH-WEI2
Top patents by PatentIndex Score
30 records- 0194US8404572B2Multi-zone temperature control for semiconductor waferCHANG CHUN-LIN·Filed 2009·Granted Mar 26, 2013·40 cites·20 claims
- 0292US8295965B2Semiconductor processing dispatch controlWU SUNNY·Filed 2010·Granted Oct 23, 2012·15 cites·7 claims
- 0392US8108060B2System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architectureTSEN ANDY·Filed 2009·Granted Jan 31, 2012·25 cites·19 claims
- 0490US10113233B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·6 cites·14 claims
- 0584US8606387B2Adaptive and automatic determination of system parametersTSAI PO-FENG·Filed 2011·Granted Dec 10, 2013·6 cites·20 claims
- 0683US9158301B2Semiconductor processing dispatch controlTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 13, 2015·4 cites·20 claims
- 0782US8396583B2Method and system for implementing virtual metrology in semiconductor fabricationTSAI PO-FENG·Filed 2010·Granted Mar 12, 2013·6 cites·20 claims
- 0882US8205173B2Physical failure analysis guiding methodsWU SUNNY·Filed 2010·Granted Jun 19, 2012·7 cites·20 claims
- 0981US8041451B2Method for bin-based controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 18, 2011·9 cites·21 claims
- 1080US9023664B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 5, 2015·3 cites·11 claims
- 1179US9519285B2Systems and associated methods for tuning processing toolsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·20 claims
- 1274US8781614B2Semiconductor processing dispatch controlWU SUNNY·Filed 2012·Granted Jul 15, 2014·2 cites·18 claims
- 1371US8452439B2Device performance parmeter tuning method and systemWU SUNNY·Filed 2011·Granted May 28, 2013·4 cites·13 claims
- 1470US9870896B2System and method for controlling ion implanterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 16, 2018·2 cites·20 claims
- 1569US9349660B2Integrated circuit manufacturing tool condition monitoring system and methodTSAI PO-FENG·Filed 2011·Granted May 24, 2016·2 cites·20 claims
- 1668US9727049B2Qualitative fault detection and classification system for tool condition monitoring and associated methodsHO CHIA-TONG·Filed 2012·Granted Aug 8, 2017·3 cites·19 claims
- 1767US8239056B2Advanced process control for new tapeout productHSU CHIH-WEI·Filed 2009·Granted Aug 7, 2012·2 cites·20 claims
- 1866US9141097B2Adaptive and automatic determination of system parametersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·1 cites·20 claims
- 1962US9250619B2Systems and methods of automatic boundary control for semiconductor processesHSU CHIH-WEI·Filed 2011·Granted Feb 2, 2016·1 cites·20 claims
- 2062US8549012B2Processing exception handlingTSAI PO-FENG·Filed 2010·Granted Oct 1, 2013·1 cites·18 claims
- 2158US8685759B2E-chuck with automated clamped force adjustment and calibrationWANG JO FEI·Filed 2010·Granted Apr 1, 2014·1 cites·20 claims
- 2258US7851233B2E-chuck for automated clamped force adjustment and calibrationTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Dec 14, 2010·0 cites·14 claims
- 2356US7977655B2Method and system of monitoring E-beam overlay and providing advanced process controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jul 12, 2011·0 cites·20 claims
- 2451US9698065B2Real-time calibration for wafer processing chamber lamp modulesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 2549US9159597B2Real-time calibration for wafer processing chamber lamp modulesCHANG CHIH-TIEN·Filed 2012·Granted Oct 13, 2015·0 cites·20 claims
- 2642US10047439B2Method and system for tool condition monitoring based on a simulated inline measurementTSAI PO FENG·Filed 2011·Granted Aug 14, 2018·0 cites·20 claims
- 2742US6019849AMethod and apparatus for automatic purge of HMDS vapor pipingTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Feb 1, 2000·11 cites·10 claims
- 2839US9026239B2APC model extension using existing APC modelsTSAI PO-FENG·Filed 2010·Granted May 5, 2015·0 cites·18 claims
- 2932US5763006AMethod and apparatus for automatic purge of HMDS vapor pipingTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jun 9, 1998·5 cites·8 claims
- 3030US5908041AMethod for cleaning a photoresist developer spray stream nozzleTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jun 1, 1999·4 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →