Inventor · disambiguated record
Junichi Ariyoshi
Also filed as: ARIYOSHI JUNICHI
27 granted patents·3 pending applications·504 citations·filing 2002–2024
96Inventor score
Files withSANDISK TECHNOLOGIES LLC8ARIYOSHI JUNICHI5FUJITSU SEMICONDUCTOR LTD4SANYO ELECTRIC CO4OGURA JUSUKE2
Top patents by PatentIndex Score
30 records- 0198US10115681B1Compact three-dimensional memory device having a seal ring and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Oct 30, 2018·209 cites·20 claims
- 0298US9543318B1Three dimensional memory device with epitaxial semiconductor pedestal for peripheral transistorsSANDISK TECHNOLOGIES INC·Filed 2015·Granted Jan 10, 2017·80 cites·18 claims
- 0397US10256245B2Three-dimensional memory device with short-free source select gate contact via structure and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Apr 9, 2019·33 cites·11 claims
- 0497US9786681B1Multilevel memory stack structure employing stacks of a support pedestal structure and a support pillar structureSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Oct 10, 2017·31 cites·12 claims
- 0596US10381450B1Three-dimensional memory device with self-aligned drain select level isolation structures and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Aug 13, 2019·22 cites·9 claims
- 0696US10083982B2Three-dimensional memory device having select gate electrode that is thicker than word lines and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Sep 25, 2018·34 cites·24 claims
- 0795US10242994B2Three-dimensional memory device containing annular etch-stop spacer and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Mar 26, 2019·24 cites·10 claims
- 0895US9524977B2Metal-semiconductor alloy region for enhancing on current in a three-dimensional memory structureSANDISK TECHNOLOGIES INC·Filed 2015·Granted Dec 20, 2016·15 cites·22 claims
- 0986US10347647B1Three-dimensional memory device containing multi-threshold-voltage drain select gates and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jul 9, 2019·6 cites·11 claims
- 1081US8173514B2Method of manufacturing semiconductor deviceOGURA JUSUKE·Filed 2009·Granted May 8, 2012·10 cites·13 claims
- 1174US8907430B2Semiconductor device and manufacturing method of semiconductor deviceUSUJIMA AKIHIRO·Filed 2009·Granted Dec 9, 2014·6 cites·3 claims
- 1271US9437596B2Semiconductor device and method for manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Sep 6, 2016·2 cites·19 claims
- 1368US7400013B1High-voltage transistor having a U-shaped gate and method for forming sameSPANSION LLC·Filed 2004·Granted Jul 15, 2008·13 cites·6 claims
- 1467US9437598B2Semiconductor device manufacturing method and semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Sep 6, 2016·2 cites·11 claims
- 1567US2025380415A1Three-dimensional memory device with through-stack contact assemblies and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1663US8741727B2Method of manufacturing semiconductor device capable of reducing a size of the semiconductor deviceARIYOSHI JUNICHI·Filed 2011·Granted Jun 3, 2014·2 cites·20 claims
- 1757US7723825B2Semiconductor device and method of manufacturing the sameFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted May 25, 2010·1 cites·23 claims
- 1857US6576518B1Method of manufacturing a mask ROM semiconductor deviceSANYO ELECTRIC CO·Filed 2002·Granted Jun 10, 2003·6 cites·9 claims
- 1955US6830978B2Semiconductor device and manufacturing method for the sameFUJITSU LTD·Filed 2003·Granted Dec 14, 2004·6 cites·13 claims
- 2051US10236286B2Semiconductor integrated circuit apparatus and manufacturing method for sameMIE FUJITSU SEMICONDUCTOR LTD·Filed 2017·Granted Mar 19, 2019·0 cites·9 claims
- 2150US7084463B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2002·Granted Aug 1, 2006·2 cites·4 claims
- 2250US2006226515A1Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2349US9935097B2Semiconductor integrated circuit apparatus and manufacturing method for sameFUJITSU SEMICONDUCTOR LTD·Filed 2015·Granted Apr 3, 2018·0 cites·7 claims
- 2447US8518795B2Method of manufacturing semiconductor deviceOGURA JUSUKE·Filed 2012·Granted Aug 27, 2013·0 cites·3 claims
- 2543US8247290B2Semiconductor device and method of manufacturing thereofARIYOSHI JUNICHI·Filed 2008·Granted Aug 21, 2012·0 cites·7 claims
- 2637US8470677B2Method of manufacturing semiconductor deviceARIYOSHI JUNICHI·Filed 2011·Granted Jun 25, 2013·0 cites·8 claims
- 2737US8435861B2Method of manufacturing a semiconductor device having different kinds of insulating films with different thicknessesARIYOSHI JUNICHI·Filed 2010·Granted May 7, 2013·0 cites·10 claims
- 2836US8415215B2Method of manufacturing semiconductor device with multiple implantation stepsARIYOSHI JUNICHI·Filed 2011·Granted Apr 9, 2013·0 cites·14 claims
- 2936US2010308397A1Semiconductor device and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2010·Application pending·0 cites
- 3034US7157336B2Method of manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2002·Granted Jan 2, 2007·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →