Inventor · disambiguated record
Jürgen Barthelmes
Also filed as: BARTHELMES JUERGEN · BARTHELMES JURGEN · BARTHELMES JÜRGEN
7 granted patents·5 pending applications·8 citations·filing 2007–2021
74Inventor score
Files withATOTECH DEUTSCHLAND GMBH5BARTHELMES JUERGEN2WUNDERLICH CHRISTIAN2BARTHELMES JÜRGEN1ST MICROELECTRONICS INT NV1
Top patents by PatentIndex Score
12 records- 0180US11011476B2Lead frame surface finishingST MICROELECTRONICS INT NV·Filed 2019·Granted May 18, 2021·3 cites·19 claims
- 0264US11756899B2Lead frame surface finishingST MICROELECTRONICS SRL·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0359US8819930B2Method for improving the adhesion between silver surfaces and resin materialsWUNDERLICH CHRISTIAN·Filed 2009·Granted Sep 2, 2014·5 cites·12 claims
- 0457US2016222523A1Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric materialATOTECH DEUTSCHLAND GMBH·Filed 2016·Application pending·0 cites
- 0557US2016168722A1Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric materialATOTECH DEUTSCHLAND GMBH·Filed 2016·Application pending·0 cites
- 0647US10867895B2Lead-frame structure, lead-frame, surface mount electronic device and methods of producing sameATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Dec 15, 2020·0 cites·14 claims
- 0746US2010288731A1Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric MaterialWUNDERLICH CHRISTIAN·Filed 2007·Application pending·0 cites
- 0843US10832997B2Lead-frame structure, lead-frame, surface mount electronic device and methods of producing sameATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Nov 10, 2020·0 cites·10 claims
- 0941US9057145B2Electrodeposition method with analysis of the electrolytic bath by solid phase extractionBARTHELMES JÜRGEN·Filed 2007·Granted Jun 16, 2015·0 cites·14 claims
- 1034US2011189481A1Post-treatment composition for increasing corrosion resistance of metal and metal alloy surfacesBARTHELMES JUERGEN·Filed 2009·Application pending·0 cites
- 1131US2019271093A1A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said methodATOTECH DEUTSCHLAND GMBH·Filed 2017·Application pending·0 cites
- 1221US8491713B2Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surfaceBARTHELMES JUERGEN·Filed 2010·Granted Jul 23, 2013·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →