Inventor · disambiguated record
Jung-Hua Chang
Also filed as: CHANG JUNG-HUA
49 granted patents·16 pending applications·75 citations·filing 2007–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30SKY TECH INC27QDLUX INC3TAIWAN SEMICONDUCTOR MFG3CHANG JUNG-HUA2
Top patents by PatentIndex Score
65 records- 0198US11682645B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·4 cites·20 claims
- 0297US12033968B2Package structure including stacked pillar portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 9, 2024·2 cites·20 claims
- 0397US11948876B2Package structure with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 2, 2024·2 cites·20 claims
- 0497US11767591B2Detachable atomic layer deposition apparatus for powdersSKY TECH INC·Filed 2021·Granted Sep 26, 2023·8 cites·8 claims
- 0596US11739423B2Atomic layer deposition apparatus for coating on fine powdersSKY TECH INC·Filed 2021·Granted Aug 29, 2023·10 cites·10 claims
- 0696US11456276B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 0795US11139260B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·8 cites·20 claims
- 0893US11952662B2Powder atomic layer deposition equipment with quick release functionSKY TECH INC·Filed 2021·Granted Apr 9, 2024·2 cites·13 claims
- 0993US10522470B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·7 cites·20 claims
- 1093US10115647B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·11 cites·20 claims
- 1192US11322380B1Substrate transfer system with tray alignerSKY TECH INC·Filed 2021·Granted May 3, 2022·2 cites·20 claims
- 1290US11784091B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 10, 2023·2 cites·20 claims
- 1389US11145562B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 1488US11735456B2Alignment mechanism and alignment method of bonding machineSKY TECH INC·Filed 2021·Granted Aug 22, 2023·2 cites·13 claims
- 1587US12368123B2Package structure including stacked pillar portions and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1685US10699981B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 1785US2025369111A1Uv-assisted and plasma enhanced process methodSKY TECH INC·Filed 2025·Application pending·0 cites
- 1884US12255173B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1984US2025323096A1Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2082US12489045B2Package structure with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2179US12421600B22-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamberSKY TECH INC·Filed 2023·Granted Sep 23, 2025·0 cites·9 claims
- 2279US11855039B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2378US12381114B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 2474US12272663B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 2571US11502040B2Package structure and semiconductor pacakgeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 2670US10777531B2Package contact structure, semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·1 cites·20 claims
- 2770US10515923B2Method for forming semiconductor package structure with twinned copper layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·1 cites·20 claims
- 2868US11773319B2Quantum dot particles with passivation layer and manufacturing method thereofSKY TECH INC·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 2968US11569159B2Structure and formation method of chip package with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 3067US11355406B2Non-vertical through-via in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 3167US2025083956A1Low concentration ozone gas supply deviceSKY TECH INC·Filed 2023·Application pending·0 cites
- 3266US11476219B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 3366US9159687B2Solder bump for ball grid arrayCHANG JUNG-HUA·Filed 2012·Granted Oct 13, 2015·2 cites·20 claims
- 3465US2025305136A1Batch type panel atomic layer deposition apparatusSKY TECH INC·Filed 2024·Application pending·0 cites
- 3563US11004797B2Package structure, semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 3663US10770427B1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 3761US11114405B2Semiconductor package structure with twinned copperTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 3860US12403685B2Plate cooling device and de-bonding station with plate cooling deviceSKY TECH INC·Filed 2023·Granted Sep 2, 2025·0 cites·9 claims
- 3959US12409612B2Bonding method and apparatus of substratesSKY TECH INC·Filed 2023·Granted Sep 9, 2025·0 cites·9 claims
- 4059US11987883B2Powder atomic layer deposition apparatus for blowing powdersSKY TECH INC·Filed 2021·Granted May 21, 2024·0 cites·10 claims
- 4158US12040215B2Bonding machine with movable suction modulesSKY TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 4258US2025232989A1Wafer holder device having heating functionSKY TECH INC·Filed 2024·Application pending·0 cites
- 4357US12031208B2Atomic layer deposition apparatus for powdersSKY TECH INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 4457US10784222B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 4557US9711472B2Solder bump for ball grid arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 18, 2017·0 cites·20 claims
- 4657US2024242946A1Low power plasma system monitor methodSKY TECH INC·Filed 2023·Application pending·0 cites
- 4756US10134701B2Solder bump for ball grid arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 4856US2025128372A1Holder plate for negative pressure chucking, holder device for negative pressure chucking, and de-bonding stationSKY TECH INC·Filed 2023·Application pending·0 cites
- 4955US2025149366A1Wafer holding device having function of positioning waferSKY TECH INC·Filed 2023·Application pending·0 cites
- 5055US2025014876A1Using plasma enhanced process to do periodic maintenanceSKY TECH INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →