Inventor · disambiguated record
Jung Wei Cheng
Also filed as: CHENG JUNG-WEI · CHENG JUNG-WEI JOHN
71 granted patents·29 pending applications·2,135 citations·filing 2006–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD84CHENG JUNG-WEI5TAIWAN SEMICONDUCTOR MFG5NAT UNIV CHUNG CHENG2CHEN MENG-TSE1
Top patents by PatentIndex Score
100 records- 0199US9496189B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·1.8k cites·19 claims
- 0298US11244879B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 0397US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0497US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0597US9275924B2Semiconductor package having a recess filled with a molding compoundWANG TSUNG-DING·Filed 2012·Granted Mar 1, 2016·64 cites·19 claims
- 0696US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0796US9935090B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·18 cites·20 claims
- 0896US9564416B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·25 cites·20 claims
- 0995US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 1093US10319607B2Package-on-package structure with organic interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 11, 2019·16 cites·20 claims
- 1193US9653443B2Thermal performance structure for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·13 cites·19 claims
- 1293US8704354B2Package on package structures and methods for forming the sameCHENG JUNG WEI·Filed 2012·Granted Apr 22, 2014·14 cites·20 claims
- 1392US11894341B2Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 1492US11705408B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 1592US9502383B23D integrated circuit package processing with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·10 cites·17 claims
- 1691US12368112B2Electronic component and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·1 cites·20 claims
- 1790US11705378B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 1890US9006032B2Package on package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·9 cites·20 claims
- 1988US11145639B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 2088US11088069B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 2188US10056267B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 21, 2018·7 cites·20 claims
- 2287US10020236B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·6 cites·20 claims
- 2387US9437551B2Concentric bump design for the alignment in die stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·7 cites·20 claims
- 2487US8658464B2Mold chase design for package-on-package applicationsCHENG JUNG WEI·Filed 2011·Granted Feb 25, 2014·10 cites·18 claims
- 2586US10522436B2Planarization of semiconductor packages and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·15 claims
- 2686US10074604B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·5 cites·20 claims
- 2786US9824902B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·5 cites·11 claims
- 2885US9691723B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·3 cites·20 claims
- 2985US9406632B2Semiconductor package including a substrate with a stepped sidewall structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·6 cites·20 claims
- 3084US10141201B2Integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 27, 2018·5 cites·20 claims
- 3183US12506116B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 3283US11404342B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 3383US2025311102A1Laminated structure with padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3482US11127644B2Planarization of semiconductor packages and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 3582US10867949B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
- 3682US9721916B2Concentric bump design for the alignment in die stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·3 cites·20 claims
- 3781US12362321B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3881US9837292B2Underfill dispensing with controlled fillet profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 5, 2017·3 cites·20 claims
- 3981US2025309193A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4080US10818614B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·2 cites·20 claims
- 4180US2025357303A1Methods of forming a packaging substrate including an underfill injection openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4279US12230589B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4379US2025349685A1Package structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4479US2025351388A1Packages with chips comprising inductor-vias and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US2025349684A1Semiconductor Device Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4677US9859267B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 4777US2025338520A1Package with Integrated Voltage Regulator and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4877US2025349732A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4976US11158614B2Thermal performance structure for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 26, 2021·2 cites·18 claims
- 5076US9165876B2Package-on-package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 20, 2015·3 cites·20 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →