Inventor · disambiguated record
Jui-Yi Chiu
Also filed as: CHIU JUI-YI
7 granted patents·10 pending applications·6 citations·filing 2010–2023
74Inventor score
Top patents by PatentIndex Score
17 records- 0172US10418395B2Methods of forming image sensor integrated circuit packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Sep 17, 2019·2 cites·8 claims
- 0271US9634059B2Methods of forming image sensor integrated circuit packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Apr 25, 2017·3 cites·19 claims
- 0362US12206155B2Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit packageQUALCOMM INC·Filed 2023·Granted Jan 21, 2025·0 cites·30 claims
- 0461US2024321507A1Three-dimensional (3d) inductor with two-side bonding wiresQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0559US12395152B2Compact hybrid acoustic wave filter structureQUALCOMM INC·Filed 2023·Granted Aug 19, 2025·0 cites·25 claims
- 0659US9386203B2Compact spacer in multi-lens array moduleOMNIVISION TECH INC·Filed 2013·Granted Jul 5, 2016·1 cites·18 claims
- 0757US2025105145A1Integrated device and integrated passive device comprising inductively coupled inductors surrounded by a magnetic materialQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0856US2025022858A1Device comprising stacked through encapsulation via interconnectsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0956US2025037923A1Package comprising a substrate with inductors and a magnetic layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1056US2025006631A1Integrated inductor including magnetic layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1155US2024387092A1Inductive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1254US2024258363A1Integrated device comprising plate interconnects and a magnetic materialQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1353US2024204039A1Device having an in-substrate inductor and method for making the inductorQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1452US2024038439A1Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1551US2019363121A1Methods of forming image sensor integrated circuit packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
- 1648US9379153B2Method for forming image sensing deviceDENG JAU-JAN·Filed 2010·Granted Jun 28, 2016·0 cites·7 claims
- 1738US10437025B2Wafer-level lens packaging methods, and associated lens assemblies and camera modulesOMNIVISION TECH INC·Filed 2015·Granted Oct 8, 2019·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →