Methods of forming image sensor integrated circuit packages

Abstract

A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor.

What is claimed is: 
     
         1 . A method of forming image sensor packages comprising:
 attaching a plurality of dam structures to a transparent substrate;   forming a plurality of conductive vias in an image sensor wafer that comprises first and second image sensor dies, wherein each of the first and second image sensor dies has at least one conductive via of the plurality of conductive vias;   forming a plurality of conductive layers on the first and second image sensor dies, wherein each of the plurality of conductive layers is electrically connected to a respective one of the plurality of conductive vias;   attaching the first image sensor die to at least a first dam structure of the plurality of dam structures and attaching the second image sensor die to at least a second dam structure of the plurality of dam structures;   performing a molding process, wherein performing the molding process comprises forming a mold material over the plurality of conductive layers; and   cutting the mold material to form first and second image sensor packages.   
     
     
         2 . The method defined in  claim 1 , wherein attaching the first image sensor die to at least the first dam structure and attaching the second image sensor die to at least the second dam structure comprises attaching the first image sensor die to at least the first dam structure and attaching the second image sensor die to at least the second dam structure after forming the plurality of conductive layers on the first and second image sensor dies. 
     
     
         3 . The method defined in  claim 1 , wherein performing the molding process comprises forming the mold material in between the first and second image sensor dies. 
     
     
         4 . The method defined in  claim 1 , wherein the transparent substrate has first and second opposing surfaces, wherein the first and second dam structures are separated by a gap, and wherein performing the molding process comprises forming the mold material in the gap between the first and second dam structures and in direct contact with the first surface of the transparent substrate. 
     
     
         5 . The method defined in  claim 1 , further comprising:
 forming vias in the mold material over the plurality of conductive layers.   
     
     
         6 . The method defined in  claim 5 , further comprising:
 forming conductive material in the vias that directly contacts the plurality of conductive layers.   
     
     
         7 . The method defined in  claim 5 , further comprising:
 forming solder balls in the vias that each directly contact at least one of the plurality of conductive layers.   
     
     
         8 . The method defined in  claim 1 , further comprising:
 before attaching the first image sensor die to at least the first dam structure and attaching the second image sensor die to at least the second dam structure, separating the first and second image sensor dies.   
     
     
         9 . The method defined in  claim 8 , wherein separating the first and second image sensor dies comprises cutting through the image sensor wafer. 
     
     
         10 . The method defined in  claim 1 , wherein cutting the mold material to form the first and second image sensor packages comprises cutting the mold material and the transparent substrate to form first and second image sensor packages. 
     
     
         11 . The method defined in  claim 1 , wherein the first dam structure has a first side surface between third and fourth opposing surfaces, wherein the second dam structure has a second side surface between fifth and sixth opposing surfaces, and wherein performing the molding process comprises forming the mold material in direct contact with the first side surface and the second side surface. 
     
     
         12 . A method of forming image sensor packages comprising:
 attaching a plurality of dam structures to a transparent substrate;   forming a plurality of conductive vias in an image sensor wafer that comprises first and second image sensor dies, wherein each of the first and second image sensor dies has at least one conductive via of the plurality of conductive vias;   forming a plurality of conductive layers on the first and second image sensor dies, wherein each of the plurality of conductive layers are electrically and mechanically connected to a respective one of the plurality of conductive vias;   after forming the plurality of conductive layers on the first and second image sensor dies, attaching the first image sensor die to at least a first dam structure of the plurality of dam structures and attaching the second image sensor die to at least a second dam structure of the plurality of dam structures;   performing a molding process, wherein performing the molding process comprises forming a mold material in between the first and second image sensor dies and over the plurality of conductive layers;   forming vias in the mold material over the plurality of conductive layers;   forming solder balls in the vias that directly contact the plurality of conductive layers; and   cutting the mold material to form first and second image sensor packages.   
     
     
         13 . A method of forming image sensor packages comprising:
 attaching at least first and second dam structures to a transparent substrate, wherein the transparent substrate has first and second opposing surfaces and wherein the first and second dam structures are separated by a gap;   forming a plurality of conductive vias in an image sensor wafer that comprises first and second image sensor dies, wherein each of the first and second image sensor dies has at least one conductive via of the plurality of conductive vias;   separating the first and second image sensor dies;   after separating the first and second image sensor dies, attaching the first image sensor die to the first dam structure and attaching the second image sensor die to the second dam structure;   performing a molding process, wherein performing the molding process comprises forming a mold material in between the first and second image sensor dies, wherein attaching the first and second dam structures to the transparent substrate comprises attaching the first and second dam structures to the first surface of the transparent substrate and wherein performing the molding process comprises forming the mold material in the gap between the first and second dam structures and in direct contact with the first surface of the transparent substrate; and   cutting the transparent substrate and the mold material to form first and second image sensor packages.   
     
     
         14 . The method defined in  claim 13 , further comprising:
 after performing the molding process, forming a plurality of conductive layers on the first and second image sensor dies, wherein each of the plurality of conductive layers are electrically and mechanically connected to a respective one of the plurality of conductive vias; and   forming a passivation layer over the conductive layers.   
     
     
         15 . The method defined in  claim 14 , wherein forming the plurality of conductive layers on the first and second image sensor dies comprises forming at least one conductive layer that extends onto and directly contacts the mold material in between the first and second image sensor dies. 
     
     
         16 . The method defined in  claim 13 , further comprising:
 before performing the molding process, forming a plurality of conductive layers on the first and second image sensor dies, wherein each of the plurality of conductive layers are electrically and mechanically connected to a respective one of the plurality of conductive vias.   
     
     
         17 . The method defined in  claim 16 , wherein performing the molding process comprises forming the mold material over the plurality of conductive layers. 
     
     
         18 . The method defined in  claim 17 , further comprising:
 forming vias in the mold material over the plurality of conductive layers; and   forming solder balls in the vias that directly contact the plurality of conductive layers.   
     
     
         19 . The method defined in  claim 13 , wherein the first dam structure has a first side surface between third and fourth opposing surfaces, wherein the second dam structure has a second side surface between fifth and sixth opposing surfaces, and wherein performing the molding process comprises forming the mold material in direct contact with the first side surface and the second side surface. 
     
     
         20 . The method defined in  claim 13 , wherein separating the first and second image sensor dies comprises cutting through the image sensor wafer.