Inventor · disambiguated record
Ju-Il Choi
Also filed as: CHOI JU-IL
65 granted patents·32 pending applications·403 citations·filing 2006–2025
98Inventor score
Top patents by PatentIndex Score
97 records- 0198US9461007B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 4, 2016·239 cites·20 claims
- 0297US11676887B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·8 cites·20 claims
- 0393US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0493US11742271B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0593US9831202B2Semiconductor devices with solder-based connection terminals and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·11 cites·14 claims
- 0693US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 0791US10325869B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·6 cites·20 claims
- 0891US9728490B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·9 cites·16 claims
- 0989US9735090B2Integrated circuit devices having through-silicon vias and methods of manufacturing such devicesCHOI JU-IL·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 1088US8872306B2Electrical interconnection structures including stress buffer layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·9 cites·16 claims
- 1187US8575760B2Semiconductor devices having electrodesPHEE JAE-HYUN·Filed 2011·Granted Nov 5, 2013·21 cites·25 claims
- 1286US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 1386US8513802B2Multi-chip package having semiconductor chips of different thicknesses from each other and related deviceMA KEUM-HEE·Filed 2011·Granted Aug 20, 2013·14 cites·22 claims
- 1483US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1582US2025343146A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1681US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1781US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 1881US7875552B2Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 25, 2011·7 cites·5 claims
- 1980US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 2080US11004814B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 2179US10128168B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameCHOI JU IL·Filed 2014·Granted Nov 13, 2018·4 cites·17 claims
- 2279US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 2379US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2478US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 2578US10049997B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 14, 2018·3 cites·28 claims
- 2678US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2777US12424572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2877US7544538B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 9, 2009·6 cites·15 claims
- 2977US2025323221A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3076US12381151B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 3176US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 3276US2025343111A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3375US8987869B2Integrated circuit devices including through-silicon-vias having integral contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·4 cites·5 claims
- 3475US8629059B2Methods of forming integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2010·Granted Jan 14, 2014·3 cites·18 claims
- 3575US2025105116A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3674US12218039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 3774US11694978B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 3873US9006902B2Semiconductor devices having through silicon vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 14, 2015·3 cites·18 claims
- 3973US2024429214A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4073US2024429189A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4172US7897511B2Wafer-level stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·4 cites·30 claims
- 4271US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 4371US12014972B2Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·13 claims
- 4471US10777487B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·1 cites·20 claims
- 4571US9543200B2Methods for fabricating semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 10, 2017·3 cites·15 claims
- 4670US11728297B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4770US10763163B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·1 cites·19 claims
- 4869US12431474B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 4969US11682630B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 5069US11581279B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →