Inventor · disambiguated record
Jungsu Ha
Also filed as: HA JUNGSU
2 granted patents·3 pending applications·12 citations·filing 2016–2024
51Inventor score
Top patents by PatentIndex Score
5 records- 0191US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0258US2025056683A1Sensor device and cooking appliance including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0357US11433341B2Filter assembly and dryer for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 6, 2022·0 cites·20 claims
- 0448US2018269126A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0542US2018220972A1Electronic device capable of measuring biometric informationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →