Inventor · disambiguated record
Juergen Hoegerl
Also filed as: HOEGERL JUERGEN
69 granted patents·11 pending applications·225 citations·filing 2003–2023
98Inventor score
Files withINFINEON TECHNOLOGIES AG72HOEGERL JUERGEN2PUESCHNER FRANK2FUERGUT EDWARD1HUAWEI TECH CO LTD1
Top patents by PatentIndex Score
80 records- 0198US10002821B1Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substratesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 19, 2018·40 cites·20 claims
- 0298US9978720B2Insulated dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 22, 2018·39 cites·4 claims
- 0393US10211133B2Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 19, 2019·8 cites·3 claims
- 0492US10128165B2Package with vertically spaced partially encapsulated contact structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·11 cites·25 claims
- 0591US10418313B2Electronic module comprising a plurality of encapsulation layers and a method for producing itINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 17, 2019·9 cites·14 claims
- 0690US10586756B2Chip carrier configured for delamination-free encapsulation and stable sinteringINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 10, 2020·6 cites·22 claims
- 0789US11385301B2Sensor devices having a sensor chip and busbarINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0889US10242969B2Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 26, 2019·12 cites·13 claims
- 0987US9748611B2Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 29, 2017·4 cites·5 claims
- 1087US7688592B2Cooling system for devices having power semiconductors and method for cooling the deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 30, 2010·23 cites·25 claims
- 1185US9633303B2Smart card module arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 25, 2017·7 cites·23 claims
- 1284US10115646B2Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 30, 2018·4 cites·26 claims
- 1383US9349709B2Electronic component with sheet-like redistribution structureINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 24, 2016·5 cites·35 claims
- 1482US11018072B2Semiconductor package having overlapping electrically conductive regions and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 25, 2021·3 cites·26 claims
- 1578US7355858B2Heat sink for surface-mounted semiconductor devices and mounting methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 8, 2008·9 cites·16 claims
- 1677US9196510B2Semiconductor package comprising two semiconductor modules and laterally extending connectorsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 24, 2015·4 cites·17 claims
- 1775US11004764B2Semiconductor package having symmetrically arranged power terminals and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 11, 2021·3 cites·19 claims
- 1875US10211158B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 19, 2019·3 cites·13 claims
- 1973US9589859B2Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·2 cites·12 claims
- 2072US9496237B2Semiconductor device having solderable and bondable electrical contact padsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 15, 2016·2 cites·20 claims
- 2170US12266586B2Double-sided coolable semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 1, 2025·0 cites·13 claims
- 2270US10699976B1Semiconductor module with external power sensorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 30, 2020·1 cites·21 claims
- 2370US9532459B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·2 cites·12 claims
- 2468USRE50485ESemiconductor module with external power sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 8, 2025·0 cites·32 claims
- 2568US11862533B2Fluid-cooled package having shielding layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 2668US9672459B2Chip card with integrated active componentsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·2 cites·18 claims
- 2768US9135549B2Smart card module, smart card and method for producing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 15, 2015·2 cites·24 claims
- 2868US9070067B2Smart card module and method for producing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 30, 2015·2 cites·21 claims
- 2968US7945231B2Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 17, 2011·6 cites·35 claims
- 3067US8991711B2Chip card modulePUESCHNER FRANK·Filed 2012·Granted Mar 31, 2015·3 cites·16 claims
- 3166US10461017B2Package with partially encapsulated cooling channel for cooling an encapsulated chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·1 cites·15 claims
- 3265US11515228B2Double sided semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 29, 2022·0 cites·13 claims
- 3365US11493538B2Sensor devices with sensor chip and busbarINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 3464US10964642B2Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common planeINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 30, 2021·1 cites·4 claims
- 3563US10453771B2Package with roughened encapsulated surface for promoting adhesionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 22, 2019·1 cites·9 claims
- 3663US9064869B2Semiconductor module and a method for fabrication thereof by extended embedding technologiesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 23, 2015·1 cites·19 claims
- 3762US8724340B2Data carrier for contactless data transmission and a method for producing such a data carrierHOEGERL JUERGEN·Filed 2012·Granted May 13, 2014·2 cites·22 claims
- 3856US11322451B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 3, 2022·0 cites·9 claims
- 3954US2019318976A1Cooling techniques for semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 4053US11610830B2Power semiconductor module and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 21, 2023·0 cites·18 claims
- 4153US2024006330A1High-symmetrical semiconductor arrangementHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 4253US2019157192A1Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 4352US10373890B1Cooling techniques for semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 4452US10304751B2Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframeINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 28, 2019·0 cites·18 claims
- 4552US9984928B2Method for producing a number of chip assemblies and method for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·0 cites·18 claims
- 4652US9721863B2Printed circuit board including a leadframe with inserted packaged semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 1, 2017·0 cites·15 claims
- 4751US8684273B2Cover structure with integrated chip and antennaINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 1, 2014·0 cites·8 claims
- 4851US2014312439A1Microphone Module and Method of Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 4950US11244886B2Package cooled with cooling fluid and comprising shielding layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 8, 2022·0 cites·22 claims
- 5049US9337155B2Semiconductor component with moisture barrier for sealing semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 10, 2016·0 cites·19 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →