Inventor · disambiguated record
Jürgen Högerl
Also filed as: HOEGERL JUERGEN · HÖGERL JÜRGEN
12 granted patents·2 pending applications·123 citations·filing 2000–2024
90Inventor score
Files withINFINEON TECHNOLOGIES AG10HUAWEI TECH CO LTD1INFINEON TECHNOLOGIES AUSTRIA1Nexperia BV1QIMONDA AG1
Top patents by PatentIndex Score
14 records- 0181US6851598B2Electronic component with a semiconductor chip and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·27 cites·25 claims
- 0280US6960829B2Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor productINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 1, 2005·30 cites·21 claims
- 0373US6646333B1Semiconductor module having interconnected semiconductor chips disposed one above the otherINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 11, 2003·20 cites·6 claims
- 0470US6665182B2Module unit for memory modules and method for its productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 16, 2003·16 cites·18 claims
- 0560US6774483B2Semiconductor assembly with a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 10, 2004·10 cites·20 claims
- 0659US2025185208A1Heat exchangerNexperia BV·Filed 2024·Application pending·0 cites
- 0758US6507106B1Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jan 14, 2003·8 cites·18 claims
- 0858US2024055310A1Semiconductor packageHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0954US6576995B2Housing for semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 10, 2003·6 cites·5 claims
- 1053US9847274B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 19, 2017·0 cites·20 claims
- 1151US6737581B2Configuration of a plurality of circuit modulesINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 18, 2004·4 cites·46 claims
- 1244US9385111B2Electronic component with electronic chip between redistribution structure and mounting structureINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jul 5, 2016·0 cites·26 claims
- 1344US7500305B2Placement system for populating a substrate with electronic componentsQIMONDA AG·Filed 2006·Granted Mar 10, 2009·0 cites·18 claims
- 1444US7069647B2Method for populating a substrate with electronic componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 4, 2006·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →