Inventor · disambiguated record
Jui-Ching Hsu
Also filed as: HSU JUI-CHING
2 granted patents·1 pending application·54 citations·filing 2009–2009
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0192US7902666B1Flip chip device having soldered metal posts by surface mountingPOWERTECH TECHNOLOGY INC·Filed 2009·Granted Mar 8, 2011·52 cites·20 claims
- 0255US8212349B2Semiconductor package having chip using copper processHSU HUNG-HSIN·Filed 2009·Granted Jul 3, 2012·2 cites·10 claims
- 0340US2011133327A1Semiconductor package of metal post solder-chip connectionHSU HUNG-HSIN·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →