Inventor · disambiguated record
Jun Ha Hwang
Also filed as: HWANG JUN HA
14 granted patents·13 pending applications·12 citations·filing 2014–2025
85Inventor score
Files withKCTECH CO LTD11SAMSUNG ELECTRONICS CO LTD6HYUNDAI MOBIS CO LTD5LG DISPLAY CO LTD2K C TECH CO LTD1
Top patents by PatentIndex Score
27 records- 0185US10439164B2Cover window and display device including the sameLG DISPLAY CO LTD·Filed 2018·Granted Oct 8, 2019·3 cites·21 claims
- 0283US11384255B2Polishing slurry composition for STI processKCTECH CO LTD·Filed 2018·Granted Jul 12, 2022·4 cites·14 claims
- 0374US9666994B2Direct-connect high voltage connector and connection structure thereofHYUNDAI MOBIS CO LTD·Filed 2015·Granted May 30, 2017·4 cites·14 claims
- 0462US10494547B2Additive composition and positive polishing slurry composition including the sameKCTECH CO LTD·Filed 2016·Granted Dec 3, 2019·1 cites·9 claims
- 0561US2025098236A1A power semiconductor device, a power converter including the same and a manufacturing method of power semiconductor deviceLX SEMICON CO LTD·Filed 2024·Application pending·0 cites
- 0657US12037516B2Polishing slurry composition and method for producing sameKCTECH CO LTD·Filed 2019·Granted Jul 16, 2024·0 cites·22 claims
- 0757US2025238147A1Memory device, operating method of memory device, and storage device including memory deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0855US12444450B2Memory device and method for managing dynamic voltage frequency scaling operations based on host configurationSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0955US11928363B2Operating method of host device and storage device and storage deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 1053US12503622B2Cerium-based particle and polishing slurry composition including the sameKCTECH CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·12 claims
- 1153US11279852B2CMP slurry compositions and methods of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·16 claims
- 1253US2025326961A1Slurry Composition for Low-K Film PolishingKCTECH CO LTD·Filed 2025·Application pending·0 cites
- 1352US12031062B2Polishing slurry composition for sti processKCTECH CO LTD·Filed 2019·Granted Jul 9, 2024·0 cites·11 claims
- 1449US2025261403A1Power semiconductor device including gate structure with improved reliabilityHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1549US2025294803A1Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1649US2025261429A1Power semiconductor device including gate with improved reliabilityHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1747US2015187502A1Capacitor module, method for manufacturing the same, and inverter for vehicle having the sameHYUNDAI MOBIS CO LTD·Filed 2014·Application pending·0 cites
- 1847US2020071566A1Slurry composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1946US10604687B2Transparent adhesive composition, transparent adhesive layer and display device including the sameLG DISPLAY CO LTD·Filed 2016·Granted Mar 31, 2020·0 cites·9 claims
- 2045US2021179891A1Polishing slurry composition for shallow trench isolation processKCTECH CO LTD·Filed 2020·Application pending·0 cites
- 2142US2019211245A1Surface-modified colloidal ceria abrasive particles, preparation method therefor, and polishing slurry composition containing sameKCTECH CO LTD·Filed 2017·Application pending·0 cites
- 2241US10138395B2Abrasive particle-dispersion layer composite and polishing slurry composition including the sameK C TECH CO LTD·Filed 2016·Granted Nov 27, 2018·0 cites·15 claims
- 2338US10435587B2Polishing compositions and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 8, 2019·0 cites·14 claims
- 2438US2021163785A1Polishing slurry composition for sti processKCTECH CO LTD·Filed 2018·Application pending·0 cites
- 2536US2019316003A1Slurry composition for polishing high stepped regionKCTECH CO LTD·Filed 2017·Application pending·0 cites
- 2634US2018362806A1Chemical mechanical polishing slurry composition and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 2733US10421883B2Abrasive particle-dispersion layer composite and polishing slurry composition including the sameKCTECH CO LTD·Filed 2016·Granted Sep 24, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →