Inventor · disambiguated record
Jun Mo Koo
Also filed as: KOO JUN M · KOO JUN MO
46 granted patents·14 pending applications·542 citations·filing 1997–2025
98Inventor score
Files withSAMSUNG SDI CO LTD24PAGAILA REZA A14SAMSUNG ELECTRONICS CO LTD6STATS CHIPPAC LTD6SK TELECOM CO LTD4
Top patents by PatentIndex Score
60 records- 0198US8796137B2Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnectPAGAILA REZA A·Filed 2010·Granted Aug 5, 2014·47 cites·26 claims
- 0298US8288201B2Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor diePAGAILA REZA A·Filed 2010·Granted Oct 16, 2012·63 cites·25 claims
- 0397US9224647B2Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposerKOO JUN MO·Filed 2011·Granted Dec 29, 2015·109 cites·14 claims
- 0497US8993377B2Semiconductor device and method of bonding different size semiconductor die at the wafer levelKOO JUN MO·Filed 2011·Granted Mar 31, 2015·70 cites·28 claims
- 0595US9875911B2Semiconductor device and method of forming interposer with opening to contain semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 23, 2018·19 cites·11 claims
- 0695US9337116B2Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor diePAGAILA REZA A·Filed 2010·Granted May 10, 2016·20 cites·38 claims
- 0793US8236617B2Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structurePAGAILA REZA A·Filed 2010·Granted Aug 7, 2012·14 cites·25 claims
- 0892US8009971B2Hand-shake correction method and apparatus of camera module for use in mobile deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 30, 2011·24 cites·16 claims
- 0991US8866294B2Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulationPAGAILA REZA A·Filed 2012·Granted Oct 21, 2014·10 cites·24 claims
- 1091US7489340B2Optical image stabilizer for camera lens assemblySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 10, 2009·24 cites·22 claims
- 1190US8642381B2Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor diePAGAILA REZA A·Filed 2010·Granted Feb 4, 2014·10 cites·24 claims
- 1290US8241964B2Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulationPAGAILA REZA A·Filed 2010·Granted Aug 14, 2012·9 cites·25 claims
- 1388US9142515B2Semiconductor device with protective layer over exposed surfaces of semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Sep 22, 2015·7 cites·25 claims
- 1487US11681085B2Polarizing plate and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2020·Granted Jun 20, 2023·2 cites·19 claims
- 1587US8435834B2Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSPPAGAILA REZA A·Filed 2010·Granted May 7, 2013·8 cites·15 claims
- 1681US9318441B2Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor diePAGAILA REZA A·Filed 2010·Granted Apr 19, 2016·5 cites·27 claims
- 1780US8999760B2Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structurePAGAILA REZA A·Filed 2012·Granted Apr 7, 2015·4 cites·28 claims
- 1878US9305854B2Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level packageSTATS CHIPPAC LTD·Filed 2013·Granted Apr 5, 2016·4 cites·26 claims
- 1974US12158600B2Polarizing plate and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 2072US9620455B2Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structurePAGAILA REZA A·Filed 2010·Granted Apr 11, 2017·3 cites·24 claims
- 2171US12271016B2Polarizing plate and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·19 claims
- 2271US2025138232A1Polarizing plate and optical display apparatusSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 2370US9679824B2Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSPSTATS CHIPPAC LTD·Filed 2013·Granted Jun 13, 2017·2 cites·11 claims
- 2470US9559039B2Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die packageSTATS CHIPPAC LTD·Filed 2013·Granted Jan 31, 2017·2 cites·19 claims
- 2569US11726248B2Polarizing plate and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·15 claims
- 2664US9437538B2Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnectSTATS CHIPPAC LTD·Filed 2014·Granted Sep 6, 2016·1 cites·20 claims
- 2763US7979143B2Apparatus and method for proportional-integral-derivative controlSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 12, 2011·2 cites·18 claims
- 2862US2025298176A1Optical laminate for stereoscopic image display apparatus and stereoscopic image display apparatusSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 2962US2025314903A1Optical laminate for stereoscopic image display apparatus and stereoscopic image display apparatusSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 3061US12498511B2Polarizing plate and optical display comprising the sameSAMSUNG SDI CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·22 claims
- 3161US6009074ACDMA modulation and demodulation method reducing interference and a communication system using the sameSK TELECOM CO LTD·Filed 1997·Granted Dec 28, 1999·30 cites·14 claims
- 3260US12498510B2Polarizing plate and optical display device comprising sameSAMSUNG SDI CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·14 claims
- 3359US5956367ARake receiving apparatus for direct sequence code division multiple access systemSK TELECOM CO LTD·Filed 1997·Granted Sep 21, 1999·29 cites·11 claims
- 3458US12461411B2Optical display device module and optical display device including sameSAMSUNG SDI CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·18 claims
- 3558US12066646B2Polarizing plate and optical display device comprising sameSAMSUNG SDI CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·18 claims
- 3658US11880055B2Polarizing plate and display device including sameSAMSUNG SDI CO LTD·Filed 2020·Granted Jan 23, 2024·0 cites·8 claims
- 3757US12253705B2Polarizing plate and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·17 claims
- 3857US11688612B2Semiconductor device and method of forming interposer with opening to contain semiconductor dieSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 27, 2023·0 cites·21 claims
- 3955US12196996B2Optical film, polarizing plate including same, and display device including sameSAMSUNG SDI CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·24 claims
- 4054US6516007B1Method for synchronizing reverse link and transmission method using synchronous reverse linkSK TELECOM CO LTD·Filed 1999·Granted Feb 4, 2003·24 cites·9 claims
- 4154US2023204823A1Optical film, polarizing plate comprising the same, and optical display apparatus comprising the sameSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 4254US2025224621A1Polarizing plate and stereoscopic image display apparatusSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 4353US12372689B2Polarizer protective film, polarization plate comprising same, and optical display apparatus comprising sameSAMSUNG SDI CO LTD·Filed 2020·Granted Jul 29, 2025·0 cites·9 claims
- 4453US9263301B2Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor diePAGAILA REZA A·Filed 2012·Granted Feb 16, 2016·0 cites·24 claims
- 4553US2024241301A1Polarizing plate and optical display apparatusSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 4653US2013299982A1Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor DieSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 4752US12360303B2Polarizing plate and optical display apparatus comprising sameSAMSUNG SDI CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·19 claims
- 4852US10242948B2Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Mar 26, 2019·0 cites·24 claims
- 4952US2024302582A1Polarizing plate and optical display apparatusSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 5051US12411274B2Polarizing plate and optical display device including sameSAMSUNG SDI CO LTD·Filed 2020·Granted Sep 9, 2025·0 cites·20 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →