Inventor · disambiguated record
Junghwa Lee
Also filed as: LEE JUNGHWA
6 granted patents·4 pending applications·19 citations·filing 2004–2025
75Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5SAMSUNG SDI CO LTD2CHANGXIN MEMORY TECH INC1CXMT CORP1IUCF HYU1
Top patents by PatentIndex Score
10 records- 0176US12015151B2Composite positive electrode active material, method of preparing the same, positive electrode including composite positive electrode active material,and lithium battery including positive electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·30 claims
- 0274US10763278B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·2 cites·20 claims
- 0372US11362330B2Composite positive electrode active material, method of preparing the same, positive electrode including composite positive electrode active material, and lithium battery including positive electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·23 claims
- 0470US7655518B2On-chip bypass capacitor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 2, 2010·4 cites·13 claims
- 0567US7177135B2On-chip bypass capacitor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 13, 2007·13 cites·24 claims
- 0656US2025273285A1Defect repair circuit and memoryCXMT CORP·Filed 2025·Application pending·0 cites
- 0754US2025334878A1Photosensitive resin composition, photosensitive resin layer prepared using same, and color filterSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 0852US2024337924A1Photosensitive resin composition, photosensitive resin layer using the same and color filterSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0947US12183431B2Semiconductor structure and chipCHANGXIN MEMORY TECH INC·Filed 2023·Granted Dec 31, 2024·0 cites·16 claims
- 1035US2021298724A1Saliva collection deviceIUCF HYU·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →