Inventor · disambiguated record
Jungbae Lee
Also filed as: LEE JUNGBAE
15 granted patents·7 pending applications·21 citations·filing 2013–2024
88Inventor score
Files withMICRON TECHNOLOGY INC18SAMSUNG ELECTRONICS CO LTD2AMKOR TECHNOLOGY INC1UNIV CHUNG ANG IND ACAD COOP FOUND1
Top patents by PatentIndex Score
22 records- 0194US11688706B2Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 27, 2023·4 cites·20 claims
- 0292US11887938B2Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 30, 2024·2 cites·9 claims
- 0389US11532595B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 20, 2022·2 cites·20 claims
- 0488US10559550B2Memory device including heterogeneous volatile memory chips and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·9 cites·17 claims
- 0586US11342277B2Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0677US11094668B2Solderless interconnect for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·2 cites·18 claims
- 0770US12341128B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 24, 2025·0 cites·15 claims
- 0866US11923332B2Semiconductor die with capillary flow structures for direct chip attachmentMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 5, 2024·0 cites·17 claims
- 0966US11682563B2Semiconductor device assembly with graded modulus underfill and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 20, 2023·0 cites·20 claims
- 1065US11810894B2Solderless interconnect for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 7, 2023·0 cites·12 claims
- 1164US11942455B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 26, 2024·0 cites·17 claims
- 1261US11404289B2Semiconductor device assembly with graded modulus underfill and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 1361US11362071B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1459US2025029878A1Methods for separating semiconductor devices using singulation grooves, and devices resulting from such methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1557US11264349B2Semiconductor die with capillary flow structures for direct chip attachmentMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 1657US2024014083A1Semiconductor device assemblies with screen-printed epoxy spacers and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1754US2024282733A1Semiconductor device with delamination reduction mechanism and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1848US2024145422A1Liquid-repelling coating for underfill bleed out controlMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1946US11621245B2Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 4, 2023·0 cites·15 claims
- 2046US2022415751A1Semiconductor packagingUNIV CHUNG ANG IND ACAD COOP FOUND·Filed 2022·Application pending·0 cites
- 2144US2015255426A1Semiconductor device with reduced warpageAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 2235US2013262740A1Semiconductor memory device, systems and methods improving refresh quality for weak cellSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →