Inventor · disambiguated record
Jui Min Lim
Also filed as: LIM JUI M · LIM JUI MIN
7 granted patents·1 pending application·107 citations·filing 2003–2013
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0192US8018072B1Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gateAMKOR TECHNOLOGY INC·Filed 2008·Granted Sep 13, 2011·28 cites·18 claims
- 0289US7183653B2Via including multiple electrical pathsINTEL CORP·Filed 2003·Granted Feb 27, 2007·62 cites·28 claims
- 0372US7952202B2Method of embedding passive component within viaINTEL CORP·Filed 2007·Granted May 31, 2011·4 cites·11 claims
- 0465US9960079B2Passive within viaINTEL CORP·Filed 2013·Granted May 1, 2018·1 cites·11 claims
- 0565US7275316B2Method of embedding passive component within viaINTEL CORP·Filed 2004·Granted Oct 2, 2007·9 cites·13 claims
- 0661US7737025B2Via including multiple electrical pathsINTEL CORP·Filed 2007·Granted Jun 15, 2010·2 cites·14 claims
- 0758US8487446B2Method of embedding passive component within viaMYERS TODD B·Filed 2011·Granted Jul 16, 2013·1 cites·11 claims
- 0835US2005121769A1Stacked integrated circuit packages and methods of making the packagesFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →