Inventor · disambiguated record
Junjun Liu
Also filed as: LIU JUNJUN
35 granted patents·15 pending applications·3,498 citations·filing 2005–2025
97Inventor score
Files withTOKYO ELECTRON LTD18SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD6LIU JUNJUN4CHANGSHU INST TECH2SHEN ZHEN MEGIX TECH CO LTD2
Top patents by PatentIndex Score
50 records- 0198US9443725B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2015·Granted Sep 13, 2016·465 cites·20 claims
- 0298US9184047B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2013·Granted Nov 10, 2015·465 cites·20 claims
- 0398US9017933B2Method for integrating low-k dielectricsLIU JUNJUN·Filed 2011·Granted Apr 28, 2015·463 cites·21 claims
- 0498US7977256B2Method for removing a pore-generating material from an uncured low-k dielectric filmTOKYO ELECTRON LTD·Filed 2008·Granted Jul 12, 2011·504 cites·24 claims
- 0598US7858533B2Method for curing a porous low dielectric constant dielectric filmTOKYO ELECTRON LTD·Filed 2008·Granted Dec 28, 2010·522 cites·26 claims
- 0698US7622378B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2005·Granted Nov 24, 2009·487 cites·24 claims
- 0797US8642488B2Multi-step system and method for curing a dielectric filmLIU JUNJUN·Filed 2009·Granted Feb 4, 2014·468 cites·18 claims
- 0895US8895942B2Dielectric treatment module using scanning IR radiation sourceLIU JUNJUN·Filed 2008·Granted Nov 25, 2014·44 cites·30 claims
- 0994US12089727B2Ring holderMEGIX TECH ASIA CO LTD·Filed 2024·Granted Sep 17, 2024·13 cites·9 claims
- 1092US7666754B2Method and system for forming an air gap structureTOKYO ELECTRON LTD·Filed 2007·Granted Feb 23, 2010·21 cites·17 claims
- 1188US7855123B2Method of integrating an air gap structure with a substrateTOKYO ELECTRON LTD·Filed 2009·Granted Dec 21, 2010·13 cites·22 claims
- 1286US11692628B2Sealing device for gas-liquid two-phase fluid medium under variable working conditionsCHANGSHU INST TECH·Filed 2021·Granted Jul 4, 2023·2 cites·7 claims
- 1385USD1093302SFoldable wireless chargerSHEN ZHEN MEGIX TECH CO LTD·Filed 2024·Granted Sep 16, 2025·8 cites·1 claims
- 1484USD1059946SLid with strawLIU JUNJUN·Filed 2024·Granted Feb 4, 2025·6 cites·1 claims
- 1583US10068765B2Multi-step system and method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2016·Granted Sep 4, 2018·2 cites·16 claims
- 1681US10615151B2Integrated circuit multichip stacked packaging structure and methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Apr 7, 2020·4 cites·20 claims
- 1778US2025364659A1Energy-storage apparatus and energy-storage systemSHENZHEN HITHIUM ENERGY STORAGE TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1874US2025329822A1Energy storage unit and energy storage systemXIAMEN HITHIUM ENERGY STORAGE TECH CO LTD·Filed 2025·Application pending·0 cites
- 1972US8242460B2Ultraviolet treatment apparatusYUE HONGYU·Filed 2011·Granted Aug 14, 2012·3 cites·20 claims
- 2071US10147640B2Method for removing back-filled pore-filling agent from a cured porous dielectricTOKYO ELECTRON LTD·Filed 2014·Granted Dec 4, 2018·2 cites·20 claims
- 2170USD1093303SFoldable wireless chargerSHEN ZHEN MEGIX TECH CO LTD·Filed 2024·Granted Sep 16, 2025·3 cites·1 claims
- 2267US10847496B2Chip wiring method and structureSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2017·Granted Nov 24, 2020·1 cites·19 claims
- 2366US7829268B2Method for air gap formation using UV-decomposable materialsTOKYO ELECTRON LTD·Filed 2007·Granted Nov 9, 2010·2 cites·21 claims
- 2463US2022196573A1Measurement system for rock volume change under microwave action and method thereofUNIV SHENZHEN·Filed 2022·Application pending·0 cites
- 2562US11390801B2Method for preparing bright near-infrared emissive carbon dots with both ultra-narrow full width at half maximum and with two-photon fluorescenceUNIV JILIN·Filed 2020·Granted Jul 19, 2022·0 cites·9 claims
- 2661US12394959B1Continuous electrical variable measuring apparatus for power distribution cabinetCHANGSHU INST TECH·Filed 2025·Granted Aug 19, 2025·0 cites·3 claims
- 2759US2023349684A1System and method for measuring rock volume change under microwave irradiationUNIV SHENZHEN·Filed 2021·Application pending·0 cites
- 2849US11103460B2Fabrication methods for nanodelivery systems for long term controlled delivery of active pharmaceutical ingredientsUNIV TEXAS·Filed 2018·Granted Aug 31, 2021·0 cites·18 claims
- 2949US10347503B2Method and hardware for enhanced removal of post etch polymer and hardmask removalTOKYO ELECTRON LTD·Filed 2014·Granted Jul 9, 2019·0 cites·20 claims
- 3048US2010068897A1Dielectric treatment platform for dielectric film deposition and curingTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3148US2010065758A1Dielectric material treatment system and method of operatingTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3248US2010067886A1Ir laser optics system for dielectric treatment moduleTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3347US10867959B2Integrated circuit packaging method and integrated packaged circuitSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Dec 15, 2020·0 cites·15 claims
- 3446US2009226695A1Method for treating a dielectric film with infrared radiationTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3546US2017037509A1Method for coating or filling a porous materialTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 3646US2009226694A1POROUS SiCOH-CONTAINING DIELECTRIC FILM AND A METHOD OF PREPARINGTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3745US2009075491A1Method for curing a dielectric filmTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 3842US10264718B2External-leadwire crimping apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·18 claims
- 3942US8956457B2Thermal processing system for curing dielectric filmsLEE ERIC M·Filed 2006·Granted Feb 17, 2015·0 cites·20 claims
- 4041US2017184497A1Plasmonic nanoparticles with hidden chiroptical activityUNIV HONG KONG BAPTIST UNIV·Filed 2016·Application pending·0 cites
- 4140US2022409070A1Proximity sensor circuits and related sensing methodsPYRAMES INC·Filed 2020·Application pending·0 cites
- 4239US11555808B2Wide-concentration multi-component hazardous gas detector and implementation method thereofSICHUAN FIRE RES INST MEM·Filed 2019·Granted Jan 17, 2023·0 cites·8 claims
- 4338US11183458B2Integrated circuit packaging structure and methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Nov 23, 2021·0 cites·7 claims
- 4438US2012225568A1Annealing method and annealing apparatusIZAWA YUSAKU·Filed 2012·Application pending·0 cites
- 4536US10930634B2Integrated circuit system and packaging method thereforSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Feb 23, 2021·0 cites·19 claims
- 4635US11335664B2Integrated circuit packaging method and integrated packaging circuitSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted May 17, 2022·0 cites·13 claims
- 4732US8444848B2Electrochemical substrate slicing using electromagnetic wave excitationYUE HONGYU H·Filed 2010·Granted May 21, 2013·0 cites·19 claims
- 4831US10693826B2Message ServiceBLACKBERRY LTD·Filed 2015·Granted Jun 23, 2020·0 cites·14 claims
- 4928US11710646B2Fan-out packaging method and fan-out packaging plateSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Granted Jul 25, 2023·0 cites·15 claims
- 5026US2021358883A1Fan-out packaging method employing combined processSHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP LP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →