Inventor · disambiguated record
Jun Lu
Also filed as: LU JUN · Lu jun-qiang
105 granted patents·11 pending applications·495 citations·filing 2007–2025
99Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR41XUE YAN XUN20ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD6ALPHA & OMEGA SEMICONDUCTOR INT LP6HO YUEH-SE6
Top patents by PatentIndex Score
116 records- 0196US7884696B2Lead frame-based discrete power inductorALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Feb 8, 2011·39 cites·20 claims
- 0295US8513784B2Multi-layer lead frame package and method of fabricationLU JUN·Filed 2010·Granted Aug 20, 2013·24 cites·17 claims
- 0394US9653383B2Semiconductor device with thick bottom metal and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted May 16, 2017·15 cites·4 claims
- 0494US8642385B2Wafer level package structure and the fabrication method thereofXUE YAN XUN·Filed 2011·Granted Feb 4, 2014·22 cites·29 claims
- 0594US8581376B2Stacked dual chip package and method of fabricationYILMAZ HAMZA·Filed 2010·Granted Nov 12, 2013·22 cites·23 claims
- 0694US8154108B2Dual-leadframe multi-chip package and method of manufactureLIU KAI·Filed 2010·Granted Apr 10, 2012·15 cites·5 claims
- 0792US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 0892US8344519B2Stacked-die package for battery power managementALPHA & OMEGA SEMICONDUCTOR·Filed 2011·Granted Jan 1, 2013·12 cites·5 claims
- 0991US9437528B1Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereofALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Sep 6, 2016·15 cites·19 claims
- 1091US8436429B2Stacked power semiconductor device using dual lead frame and manufacturing methodXUE YAN XUN·Filed 2011·Granted May 7, 2013·13 cites·10 claims
- 1191US7898092B2Stacked-die package for battery power managementALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Mar 1, 2011·22 cites·22 claims
- 1290US9397029B1Power semiconductor package device having locking mechanism, and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jul 19, 2016·7 cites·6 claims
- 1390US9041172B1Semiconductor device for restraining creep-age phenomenon and fabricating method thereofNIU ZHI QIANG·Filed 2013·Granted May 26, 2015·21 cites·20 claims
- 1490US8952509B1Stacked multi-chip bottom source semiconductor device and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Feb 10, 2015·15 cites·15 claims
- 1590US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 1689US9184117B2Stacked dual-chip packaging structure and preparation method thereofHO YUEH-SE·Filed 2012·Granted Nov 10, 2015·11 cites·18 claims
- 1789US8481368B2Semiconductor package of a flipped MOSFET and its manufacturing methodXUE YAN XUN·Filed 2011·Granted Jul 9, 2013·11 cites·5 claims
- 1889US7971340B2Planar grooved power inductor structure and methodALPHA & OMEGA SEMICONDUCTOR·Filed 2011·Granted Jul 5, 2011·7 cites·11 claims
- 1989US7948346B2Planar grooved power inductor structure and methodALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted May 24, 2011·14 cites·17 claims
- 2087US9054091B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structuresYILMAZ HAMZA·Filed 2013·Granted Jun 9, 2015·6 cites·18 claims
- 2187US7884454B2Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device packageALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Feb 8, 2011·11 cites·20 claims
- 2287US7843303B2Multilayer inductorALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Nov 30, 2010·13 cites·15 claims
- 2386US9230949B2Method of making stacked multi-chip packaging structureALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jan 5, 2016·4 cites·9 claims
- 2486US8575006B2Process to form semiconductor packages with external leadsXUE YAN XUN·Filed 2009·Granted Nov 5, 2013·14 cites·20 claims
- 2586US8178954B2Structure of mixed semiconductor encapsulation structure with multiple chips and capacitorsXUE YAN XUN·Filed 2010·Granted May 15, 2012·7 cites·12 claims
- 2685US8563361B2Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2012·Granted Oct 22, 2013·8 cites·8 claims
- 2784US9269699B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Feb 23, 2016·6 cites·18 claims
- 2883US9214417B2Combined packaged power semiconductor deviceHO YUEH-SE·Filed 2014·Granted Dec 15, 2015·5 cites·6 claims
- 2982US9318603B2Method of making a low-Rdson vertical power MOSFET deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Apr 19, 2016·5 cites·5 claims
- 3081US9006870B2Stacked multi-chip packaging structure and manufacturing method thereofZHANG XIAOTIAN·Filed 2013·Granted Apr 14, 2015·4 cites·12 claims
- 3181US8586414B2Top exposed package and assembly methodXUE YAN XUN·Filed 2010·Granted Nov 19, 2013·6 cites·17 claims
- 3281US8519525B2Semiconductor encapsulation and method thereofXUE YAN XUN·Filed 2010·Granted Aug 27, 2013·5 cites·9 claims
- 3380US9293397B1Power device and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Mar 22, 2016·3 cites·10 claims
- 3478US10600727B2Molded intelligent power module for motorsALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Mar 24, 2020·4 cites·20 claims
- 3578US9171788B1Semiconductor package with small gate clip and assembly methodALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Oct 27, 2015·3 cites·12 claims
- 3678US8686546B2Combined packaged power semiconductor deviceHO YUEH-SE·Filed 2011·Granted Apr 1, 2014·5 cites·23 claims
- 3778US8283212B2Method of making a copper wire bond packageXUE YAN XUN·Filed 2010·Granted Oct 9, 2012·5 cites·12 claims
- 3878US8247288B2Method of integrating a MOSFET with a capacitorXUE YAN XUN·Filed 2010·Granted Aug 21, 2012·5 cites·23 claims
- 3978US8076183B2Method of attaching an interconnection plate to a semiconductor die within a leadframe packageXUE YAN XUN·Filed 2009·Granted Dec 13, 2011·7 cites·21 claims
- 4077US8669650B2Flip chip semiconductor deviceZHANG XIAOTIAN·Filed 2011·Granted Mar 11, 2014·5 cites·27 claims
- 4176US10141249B2Molded intelligent power module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Nov 27, 2018·2 cites·12 claims
- 4275US8482048B2Metal oxide semiconductor field effect transistor integrating a capacitorXUE YAN XUN·Filed 2010·Granted Jul 9, 2013·4 cites·20 claims
- 4375US7939370B1Power semiconductor packageALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted May 10, 2011·6 cites·27 claims
- 4474US8455303B2Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodZHANG XIAOTIAN·Filed 2012·Granted Jun 4, 2013·3 cites·8 claims
- 4574US8302287B2Method of manufacturing a multilayer inductorLU JUN·Filed 2010·Granted Nov 6, 2012·3 cites·7 claims
- 4672US9318424B2MCSP power semiconductor devices and preparation methods thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Apr 19, 2016·2 cites·13 claims
- 4772US8933518B2Stacked power semiconductor device using dual lead frameXUE YAN XUN·Filed 2013·Granted Jan 13, 2015·3 cites·7 claims
- 4872US8709893B2Method of making a low-Rdson vertical power MOSFET deviceSU YI·Filed 2011·Granted Apr 29, 2014·3 cites·12 claims
- 4971US11201420B2Package protector with integrated guide pinINTEL CORP·Filed 2018·Granted Dec 14, 2021·3 cites·20 claims
- 5070US8722466B2Semiconductor packaging and fabrication method using connecting plate for internal connectionLU JUN·Filed 2010·Granted May 13, 2014·2 cites·6 claims
Showing the top 50 of 116 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →